SLUSCI1B August   2016  – November 2016

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics: Supply Current
   6. 6.6  Electrical Characteristics: Digital Input and Output DC Characteristics
   7. 6.7  Electrical Characteristics: Power-On Reset
   8. 6.8  Electrical Characteristics: LDO Regulator
   9. 6.9  Electrical Characteristics: Internal Temperature Sensor
   10. 6.10 Electrical Characteristics: Low-Frequency Clock Oscillator
   11. 6.11 Electrical Characteristics: High-Frequency Clock Oscillator
   12. 6.12 Electrical Characteristics: Integrating ADC (Coulomb Counter)
   13. 6.13 Electrical Characteristics: ADC (Temperature and Voltage Measurements)
   14. 6.14 Electrical Characteristics: Data Flash Memory
   15. 6.15 Timing Requirements: I2C-Compatible Interface Timing Characteristics
   16. 6.16 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Communications
         1. 7.3.1.1 I2C Interface
         2. 7.3.1.2 I2C Time Out
   4. 7.4 Device Functional Modes
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 BAT Voltage Sense Input
         2. 8.2.2.2 SRP and SRN Current Sense Inputs
         3. 8.2.2.3 Sense Resistor Selection
         4. 8.2.2.4 TS Temperature Sense Input
         5. 8.2.2.5 Thermistor Selection
         6. 8.2.2.6 REGIN Power Supply Input Filtering
         7. 8.2.2.7 REG25 LDO Output Filtering
      3. 8.2.3 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Power Supply Decoupling Capacitor
       2. 10.1.2 Capacitors
       3. 10.1.3 Communication Line Protection Components
    2. 10.2 Layout Example
       1. 10.2.1 Ground System
       2. 10.2.2 Kelvin Connections
       3. 10.2.3 Board Offset Considerations
       4. 10.2.4 ESD Spark Gap
11. 11Device and Documentation Support
    1. 11.1 Documentation Support
       1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
12. 12Mechanical, Packaging, and Orderable Information