SLUSBE4B January   2014  – June 2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  A6 Coil Specification
      2. 8.3.2  EMI Shield
      3. 8.3.3  I2C Interface
      4. 8.3.4  Active or Passive Wake-up State
      5. 8.3.5  Smart Key or Immobilizer Handling
      6. 8.3.6  Option Select Pins
      7. 8.3.7  LED Modes
      8. 8.3.8  Foreign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) CalibrationForeign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) Calibration description.
      9. 8.3.9  Shut Down via External Thermal Sensor or Trigger
      10. 8.3.10 Fault Handling and Indication
      11. 8.3.11 Power Transfer Start Signal
      12. 8.3.12 Power-On Reset
      13. 8.3.13 External Reset, RESET Pin
      14. 8.3.14 Trickle Charge and CS100
        1. 8.3.14.1 Over-Current Protection Over-Current Protection description.
      15. 8.3.15 Over-Voltage Protection Over-Voltage Protection section.
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Transfer
      2. 8.4.2 Communication
      3. 8.4.3 Power Trains
      4. 8.4.4 Signal Processing Components
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Capacitor Selection
        2. 9.2.1.2 Current Monitoring Requirements
        3. 9.2.1.3 All Unused Pins
        4. 9.2.1.4 Input Regulators
        5. 9.2.1.5 Input Power Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Active or Passive Wake-up State
        2. 9.2.2.2 EMI Shield
        3. 9.2.2.3 LED mode
        4. 9.2.2.4 Number of Transmitter Coils
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.