SLUSCD3A August   2015  – October 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 A11 Coil Specification
      2. 7.3.2 Option Select Pins
      3. 7.3.3 LED Modes
      4. 7.3.4 Foreign Object Detection (FOD) and FOD Calibration
      5. 7.3.5 Shut Down Through External Thermal Sensor or Trigger
      6. 7.3.6 Fault Handling and Indication
      7. 7.3.7 Power Transfer Start Signal
      8. 7.3.8 Power-On Reset
      9. 7.3.9 Trickle Charge and CS100
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Transfer
        1. 7.4.1.1 Dynamic Power Limiting™
        2. 7.4.1.2 Operating Frequency Limiting
      2. 7.4.2 Communication
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Current Monitoring Requirements
        3. 8.2.2.3 Input Voltage Monitoring
        4. 8.2.2.4 Tank Voltage Monitoring
        5. 8.2.2.5 All Unused Pins
        6. 8.2.2.6 Input Regulation
        7. 8.2.2.7 System Input Power Requirements
        8. 8.2.2.8 LED Modes
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Notes
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

  1. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com
  2. Analog applications journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill, SLYT401
  3. Data sheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, SLVSAT9
  4. Application note, Building a Wireless Power Transmitter, SLUA635
  5. Application note, bqTESLA Transmitter Coil Vendors, SLUA649
  6. User’s Guide, bq50002 and bq500511 Wireless Power TX EVM, SLVUAJ7

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

Dynamic Power Limiting (DPL), E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.