SLUSCF5C April   2016  – July 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  MP-A5 Coil Specification
      2. 8.3.2  High Voltage Dedicated Charging Port (HVDCP) Negotiation
      3. 8.3.3  Fast Charge Support
      4. 8.3.4  Option Select Pins
      5. 8.3.5  FOD and Parasitic Metal Object Detect (PMOD) Calibration
      6. 8.3.6  FOD Ping Calibration
      7. 8.3.7  Shut Down Through External Thermal Sensor or Trigger
      8. 8.3.8  Fault Handling and Indication
      9. 8.3.9  Power Transfer Start Signal
      10. 8.3.10 Power-On Reset
      11. 8.3.11 External Reset, RESET Pin
      12. 8.3.12 Trickle Charge and CS100
    4. 8.4 Device Functional Modes
      1. 8.4.1 LED Modes
      2. 8.4.2 Power Transfer
      3. 8.4.3 Communication
      4. 8.4.4 Power Trains
      5. 8.4.5 Power Train Voltage Control
      6. 8.4.6 Signal Processing Components
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Capacitor Selection
        2. 9.2.2.2 Current Monitoring Requirements
        3. 9.2.2.3 All Unused Pins
        4. 9.2.2.4 Input Regulators
        5. 9.2.2.5 Input Power Requirements
        6. 9.2.2.6 LED Mode
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

  1. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com/
  2. Data sheet, bq51025 WPC v1.1 Compliant Single Chip Wireless Power Receiver With Proprietary 10-W Power Delivery, SLUSBX7
  3. Data sheet, bq500100 Wireless Charging Current Monitor, SBOS765
  4. Data sheet, bq500101 NexFET Power Stage, SLPS585
  5. Data sheet, TLV70450 24-V Input Voltage, 150-mA, Ultralow IQ Low-Dropout Regulators, SBVS148
  6. Data sheet, TPS54231 2-A, 28-V Input, Step-Down DC-DC Converter With Eco-mode, SLUS851
  7. Application note, Building a Wireless Power Transmitter, SLUA635
  8. Application note, bqTESLA Transmitter Coil Vendors, SLUA649

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates — go to the product folder for your device on ti.com. In the upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.