SLUSAD3C June   2011  – October 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics - AC SPI Data Interface
    7. 6.7 Vertical Communications Bus
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog-to-Digital Conversion (ADC)
        1. 7.3.1.1  General Features
        2. 7.3.1.2  3-to-6 Series Cell Configuration
        3. 7.3.1.3  Cell Voltage Measurements
        4. 7.3.1.4  GPAI or VBAT Measurements
          1. 7.3.1.4.1 Converting GPAI Result to Voltage
          2. 7.3.1.4.2 Converting VBAT Result to Voltage
        5. 7.3.1.5  Temperature Measurement
          1. 7.3.1.5.1 External Temperature Sensor Support (TS1+, TS1-, TS2+, and TS2-)
          2. 7.3.1.5.2 Converting TSn Result to Voltage (Ratio)
        6. 7.3.1.6  ADC Band-Gap Voltage Reference
        7. 7.3.1.7  Conversion Control
          1. 7.3.1.7.1 Convert Start
            1. 7.3.1.7.1.1 Hardware Start
            2. 7.3.1.7.1.2 Firmware Start
          2. 7.3.1.7.2 Data Ready
          3. 7.3.1.7.3 ADC Channel Selection
          4. 7.3.1.7.4 Conversion Time Control
          5. 7.3.1.7.5 Automatic Versus Manual Control
        8. 7.3.1.8  Secondary Protection
          1. 7.3.1.8.1 Protector Functionality
            1. 7.3.1.8.1.1 Using the Protector Functions With 3-5 Cells
        9. 7.3.1.9  Cell Overvoltage Fault Detection (COV)
        10. 7.3.1.10 Cell Undervoltage Fault Detection (CUV)
        11. 7.3.1.11 Overtemperature Detection
          1. 7.3.1.11.1 Ratiometric Sensing
          2. 7.3.1.11.2 Thermistor Power
          3. 7.3.1.11.3 Thermistor Input Conditioning
        12. 7.3.1.12 Fault and Alert Behavior
          1. 7.3.1.12.1 Fault Recovery Procedure
        13. 7.3.1.13 Secondary Protector Built-In Self-Test Features
      2. 7.3.2 Cell Balancing
        1. 7.3.2.1 Cell Balance Control Safety Timer
      3. 7.3.3 Other Features and Functions
        1. 7.3.3.1 Internal Voltage Regulators
          1. 7.3.3.1.1 Internal 5-V Analog Supply
          2. 7.3.3.1.2 Internal 5-V Digital Supply
          3. 7.3.3.1.3 Low-Dropout Regulator (REG50)
          4. 7.3.3.1.4 Auxiliary Power Output (AUX)
        2. 7.3.3.2 Undervoltage Lockout and Power-On Reset
          1. 7.3.3.2.1 UVLO
          2. 7.3.3.2.2 Power-On Reset (POR)
          3. 7.3.3.2.3 Reset Command
        3. 7.3.3.3 Thermal Shutdown (TSD)
        4. 7.3.3.4 GPIO
      4. 7.3.4 Communications
        1. 7.3.4.1 SPI Communications - Device to Host
      5. 7.3.5 Device-to-Device Vertical Bus (VBUS) Interface
      6. 7.3.6 Packet Formats
        1. 7.3.6.1 Data Read Packet
        2. 7.3.6.2 Data Write Packet
        3. 7.3.6.3 Broadcast Writes
        4. 7.3.6.4 Communications Packet Structure
        5. 7.3.6.5 CRC Algorithm
        6. 7.3.6.6 Data Packet Usage Examples
      7. 7.3.7 Device Addressing
      8. 7.3.8 Changes and Enhancements for bq76PL536A
    4. 7.4 Device Functional Modes
      1. 7.4.1 SLEEP Functionality
        1. 7.4.1.1 SLEEP State Entry (Bit Set)
        2. 7.4.1.2 Sleep State Exit (Bit Reset)
    5. 7.5 Programming
      1. 7.5.1 Programming the EPROM Configuration Registers
    6. 7.6 Register Maps
      1. 7.6.1  I/O Register Details
      2. 7.6.2  Register Types
        1. 7.6.2.1 Read-Only (Group 1)
        2. 7.6.2.2 Read / Write (Group 2)
        3. 7.6.2.3 Read / Write, Initialized From EPROM (Group3)
        4. 7.6.2.4 Error Checking and Correcting (ECC) EPROM
      3. 7.6.3  Register Details
        1. 7.6.3.1 DEVICE_STATUS Register (0x00)
      4. 7.6.4  GPAI (0x01, 0x02) Register
      5. 7.6.5  VCELLn Register (0x03…0x0e)
      6. 7.6.6  TEMPERATURE1 Register (0x0f, 0x10)
      7. 7.6.7  TEMPERATURE2 Register (0x11, 0x12)
      8. 7.6.8  ALERT_STATUS Register (0x20)
      9. 7.6.9  FAULT_STATUS Register (0x21)
      10. 7.6.10 COV_FAULT Register (0x22)
      11. 7.6.11 CUV_FAULT Register (0x23)
      12. 7.6.12 PARITY_H Register (0x24) (PRESULT_A (R/O))
      13. 7.6.13 PARITY_H Register (0x25) (PRESULT_B (R/O))
      14. 7.6.14 ADC_CONTROL Register (0x30)
      15. 7.6.15 IO_CONTROL Register (0x31)
      16. 7.6.16 CB_CTRL Register (0x32)
      17. 7.6.17 CB_TIME Register (0x33)
      18. 7.6.18 ADC_CONVERT Register (0x34)
      19. 7.6.19 SHDW_CTRL Register (0x3a)
      20. 7.6.20 ADDRESS_CONTROL Register (0x3b)
      21. 7.6.21 RESET Register (0x3c)
      22. 7.6.22 TEST_SELECT Register (0x3d)
      23. 7.6.23 E_EN Register (0x3f)
      24. 7.6.24 FUNCTION_CONFIG Register (0x40)
      25. 7.6.25 IO_CONFIG Register (0x41)
      26. 7.6.26 CONFIG_COV Register (0x42)
      27. 7.6.27 CONFIG_COVT Register (0x43)
      28. 7.6.28 CONFIG_UV Register (0x44)
      29. 7.6.29 CONFIG_CUVT Register (0x45)
      30. 7.6.30 CONFIG_OT Register (0x46)
      31. 7.6.31 CONFIG_OTT Register (0x47)
      32. 7.6.32 USERx Register (0x48-0x4b) (USER1-4)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Anti-Aliasing Filter
      2. 8.1.2 Host SPI Interface Pin States
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Other Schematics
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.