SLUSB48 July   2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Description (continued)
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics: Supply Current
    6. 8.6  Electrical Characteristics: I/O
    7. 8.7  Electrical Characteristics: ADC
    8. 8.8  Electrical Characteristics: Power-On Reset
    9. 8.9  Electrical Characteristics: Oscillator
    10. 8.10 Electrical Characteristics: Data Flash Memory
    11. 8.11 Electrical Characteristics: Register Backup
    12. 8.12 SMBus Timing Specifications
    13. 8.13 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Primary (1st Level) Safety Features
      2. 9.3.2 Secondary (2nd Level) Safety Features
      3. 9.3.3 Charge Control Features
      4. 9.3.4 Fuel Gauging
      5. 9.3.5 Lifetime Data Logging
      6. 9.3.6 Authentication
      7. 9.3.7 Battery Parameter Measurements
        1. 9.3.7.1 Current and Coulomb Counting
        2. 9.3.7.2 Voltage
        3. 9.3.7.3 Temperature
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 Physical Interface
      2. 9.5.2 SMBus Address
      3. 9.5.3 SMBus On and Off State
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Schematic
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Measurement System
          1. 10.2.3.1.1 Cell Voltages
          2. 10.2.3.1.2 External Average Cell Voltage
          3. 10.2.3.1.3 Current
          4. 10.2.3.1.4 Temperature
        2. 10.2.3.2 Gas Gauging
        3. 10.2.3.3 Charging
          1. 10.2.3.3.1 Fast Charging Voltage
          2. 10.2.3.3.2 Fast Charging Current
          3. 10.2.3.3.3 Other Charging Modes
        4. 10.2.3.4 Protection
        5. 10.2.3.5 Peripheral Features
          1. 10.2.3.5.1 LED Display
          2. 10.2.3.5.2 SMBus Address
      4. 10.2.4 Application Performance Plots
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Power Supply Decoupling Capacitor
      2. 12.1.2 MRST Connection
      3. 12.1.3 Communication Line Protection Components
      4. 12.1.4 ESD Spark Gap
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Related Documentation

For related documentation, see the following:

  • bq78350 Technical Reference Manual (SLUUAN7)
  • Using the bq78350 Application Note (SLUA726)
  • bq769x0 3-Series to 15-Series Cell Battery Monitor Family for Li-Ion and Phosphate Applications Data Manual (SLUSBK2)

13.2 Trademarks

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.