SWRS183B June   2016  – July 2018 CC1350

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 5.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 5.12 PLL Parameters
    13. 5.13 ADC Characteristics
    14. 5.14 Temperature Sensor
    15. 5.15 Battery Monitor
    16. 5.16 Continuous Time Comparator
    17. 5.17 Low-Power Clocked Comparator
    18. 5.18 Programmable Current Source
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Characteristics
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.21.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.21.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.21.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.21.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    22. 5.22 Typical Characteristics
    23. 5.23 Typical Characteristics – Sub-1 GHz
    24. 5.24 Typical Characteristics – 2.4 GHz
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Additional Information
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
  • RGZ|48
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The CC1350 device is a cost-effective, ultra-low-power, dual-band RF device from Texas Instruments™ that is part of the SimpleLink microcontroller (MCU) platform. The platform consists of Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, Ethernet, Zigbee®, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich tool set. A one-time integration of the SimpleLink platform enables users to add any combination of devices from the portfolio into their design, allowing 100 percent code reuse when design requirements change. For more information, visit www.ti.com/simplelink.

With very low active RF and MCU current consumption, in addition to flexible low-power modes, the device provides excellent battery life and allows long-range operation on small coin-cell batteries and in energy harvesting applications.

The CC1350 is a device in the CC13xx and CC26xx family of cost-effective, ultra-low-power wireless MCUs capable of handling both Sub-1 GHz and 2.4-GHz RF frequencies. The CC1350 device combines a flexible, very low-power RF transceiver with a powerful 48-MHz Arm® Cortex®-M3 microcontroller in a platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Cortex®-M0) handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power and flexibility to handle both Sub-1 GHz protocols and 2.4 GHz protocols (for example Bluetooth low energy). This enables the combination of a Sub-1 GHz communication solution that offers the best possible RF range together with a Bluetooth low energy smartphone connection that enables great user experience through a phone application. The Sub-1 GHz only device in this family is the CC1310.

The CC1350 device is a highly integrated, true single-chip solution incorporating a complete RF system and an on-chip DC/DC converter.

Sensors can be handled in a very low-power manner by a dedicated autonomous ultra-low-power MCU that can be configured to handle analog and digital sensors; thus the main MCU (Arm® Cortex®-M3) can maximize sleep time.

The power and clock management and radio systems of the CC1350 device require specific configuration and handling by software to operate correctly, which has been implemented in the TI-RTOS. TI recommends using this software framework for all application development on the device. The complete TI-RTOS and device drivers are offered free of charge in source code.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
CC1350F128RGZ VQFN (48) 7.00 mm × 7.00 mm
CC1350F128RHB VQFN (32) 5.00 mm × 5.00 mm
CC1350F128RSM VQFN (32) 4.00 mm × 4.00 mm
For more information, see Section 9.