SWRS172A July   2014  – November 2015 CC2540T


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Electrical Characteristics
    5. 4.5  Thermal Resistance Characteristics for RHA Package
    6. 4.6  General Characteristics
    7. 4.7  RF Receive Section
    8. 4.8  RF Transmit Section
    9. 4.9  Current Consumption With TPS62730
    10. 4.10 32-MHz Crystal Oscillator
    11. 4.11 32.768-kHz Crystal Oscillator
    12. 4.12 32-kHz RC Oscillator
    13. 4.13 16-MHz RC Oscillator
    14. 4.14 RSSI Characteristics
    15. 4.15 Frequency Synthesizer Characteristics
    16. 4.16 Analog Temperature Sensor
    17. 4.17 Comparator Characteristics
    18. 4.18 ADC Characteristics
    19. 4.19 Control Input AC Characteristics
    20. 4.20 SPI AC Characteristics
    21. 4.21 Debug Interface AC Characteristics
    22. 4.22 Timer Inputs AC Characteristics
    23. 4.23 DC Characteristics
    24. 4.24 Typical Characteristics
    25. 4.25 Typical Current Savings
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Block Descriptions
      1. 5.3.1 CPU and Memory
      2. 5.3.2 Peripherals
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Input/Output Matching
    3. 6.3 Crystal
    4. 6.4 On-Chip 1.8-V Voltage Regulator Decoupling
    5. 6.5 Power-Supply Decoupling and Filtering
    6. 6.6 Reference Design
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
      2. 7.1.2 Community Resources
    2. 7.2 Texas Instruments Low-Power RF Website
    3. 7.3 Texas Instruments Low-Power RF Developer Network
    4. 7.4 Low-Power RF eNewsletter
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

7.1 Documentation Support

7.1.1 Related Documentation

The following documents describe the CC2540T processor. Copies of these documents are available on the Internet at www.ti.com.

    [1]Bluetooth® Core Technical Specification, Core Version 4.0
    SWRU191CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee® Applications, CC2540/41 System-on-Chip Solution for 2.4-GHz Bluetooth Low Energy Applications
    SWRA365Current Savings in CC254x Using the TPS62730

7.1.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.2 Texas Instruments Low-Power RF Website

  • Forums, videos, and blogs
  • RF design help
  • E2E interaction

Join us today at www.ti.com/lprf-forum.

7.3 Texas Instruments Low-Power RF Developer Network

Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:

  • RF circuit, low-power RF, and ZigBee® design services
  • Low-power RF and ZigBee module solutions and development tools
  • RF certification services and RF circuit manufacturing

Need help with modules, engineering services, or development tools?

Search the Low-Power RF Developer Network tool to find a suitable partner.

7.4 Low-Power RF eNewsletter

The Low-Power RF eNewsletter keeps the user up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information.

Sign up today on

7.5 Trademarks

SmartRF, SimpleLink, E2E are trademarks of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

IAR Embedded Workbench is a trademark of IAR Systems AB.

ZigBee is a registered trademark of ZigBee Alliance, Inc.

All other trademarks are the property of their respective owners.

7.6 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.7 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.8 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.