SWRS172A July   2014  – November 2015 CC2540T


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Electrical Characteristics
    5. 4.5  Thermal Resistance Characteristics for RHA Package
    6. 4.6  General Characteristics
    7. 4.7  RF Receive Section
    8. 4.8  RF Transmit Section
    9. 4.9  Current Consumption With TPS62730
    10. 4.10 32-MHz Crystal Oscillator
    11. 4.11 32.768-kHz Crystal Oscillator
    12. 4.12 32-kHz RC Oscillator
    13. 4.13 16-MHz RC Oscillator
    14. 4.14 RSSI Characteristics
    15. 4.15 Frequency Synthesizer Characteristics
    16. 4.16 Analog Temperature Sensor
    17. 4.17 Comparator Characteristics
    18. 4.18 ADC Characteristics
    19. 4.19 Control Input AC Characteristics
    20. 4.20 SPI AC Characteristics
    21. 4.21 Debug Interface AC Characteristics
    22. 4.22 Timer Inputs AC Characteristics
    23. 4.23 DC Characteristics
    24. 4.24 Typical Characteristics
    25. 4.25 Typical Current Savings
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Block Descriptions
      1. 5.3.1 CPU and Memory
      2. 5.3.2 Peripherals
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Input/Output Matching
    3. 6.3 Crystal
    4. 6.4 On-Chip 1.8-V Voltage Regulator Decoupling
    5. 6.5 Power-Supply Decoupling and Filtering
    6. 6.6 Reference Design
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
      2. 7.1.2 Community Resources
    2. 7.2 Texas Instruments Low-Power RF Website
    3. 7.3 Texas Instruments Low-Power RF Developer Network
    4. 7.4 Low-Power RF eNewsletter
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Applications, Implementation, and Layout


Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

6.1 Application Information

Few external components are required for the operation of the CC2540T. A typical application circuit is shown in Figure 6-1.

CC2540T S0383-03_WRS172.gif
(1) 32-kHz crystal is mandatory when running the chip in low-power modes, except if the link layer is in the standby state (Vol. 6 Part B Section 1.1, see [1]).


Different antenna alternatives will be provided as reference designs.
Figure 6-1 CC2540T Application Circuit

Table 6-1 Overview of External Components (Excluding Supply Decoupling Capacitors)

C221 32-MHz XTAL loading capacitor 12 pF
C231 32-MHz XTAL loading capacitor 12 pF
C251 Part of the RF matching network 18 pF
C252 Part of the RF matching network 1 pF
C253 Part of the RF matching network 1 pF
C261 Part of the RF matching network 18 pF
C262 Part of the RF matching network 1 pF
C321 32-kHz XTAL loading capacitor 15 pF
C331 32-kHz XTAL loading capacitor 15 pF
C401 Decoupling capacitor for the internal digital regulator 1 µF
L251 Part of the RF matching network 2 nH
L252 Part of the RF matching network 1 nH
L253 Part of the RF matching network 3 nH
L261 Part of the RF matching network 2 nH
R301 Resistor used for internal biasing 56 kΩ

6.2 Input/Output Matching

When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252.

6.3 Crystal

An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See Section 4.10 for details. The load capacitance seen by the 32-MHz crystal is given by Equation 1:

Equation 1. CC2540T E001_WRS081.gif

XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by Equation 2:

Equation 2. CC2540T E002_WRS081.gif

A series resistor may be used to comply with the ESR requirement.

6.4 On-Chip 1.8-V Voltage Regulator Decoupling

The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation.

6.5 Power-Supply Decoupling and Filtering

Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely (see Section 6.6).

6.6 Reference Design

Bluetooth Low Energy Light Reference Design

This reference design is an example of using the SimpleLink™ Bluetooth low energy CC2540T high temperature range, wireless microcontroller in lighting applications. The board includes RGBW LEDs controlled by the CC2540T and is USB powered. The board can be controlled out-of-the-box by the TI BLE Multitool smart phone app.