SWRS176B February   2015  – July 2016 CC2640


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  1-Mbps GFSK (Bluetooth low energy Technology) - RX
    7. 5.7  1-Mbps GFSK (Bluetooth low energy Technology) - TX
    8. 5.8  2-Mbps GFSK (Bluetooth 5) - RX
    9. 5.9  2-Mbps GFSK (Bluetooth 5) - TX
    10. 5.10 5-Mbps (Proprietary) - RX
    11. 5.11 5-Mbps (Proprietary) - TX
    12. 5.12 24-MHz Crystal Oscillator (XOSC_HF)
    13. 5.13 32.768-kHz Crystal Oscillator (XOSC_LF)
    14. 5.14 48-MHz RC Oscillator (RCOSC_HF)
    15. 5.15 32-kHz RC Oscillator (RCOSC_LF)
    16. 5.16 ADC Characteristics
    17. 5.17 Temperature Sensor
    18. 5.18 Battery Monitor
    19. 5.19 Continuous Time Comparator
    20. 5.20 Low-Power Clocked Comparator
    21. 5.21 Programmable Current Source
    22. 5.22 Synchronous Serial Interface (SSI)
    23. 5.23 DC Characteristics
    24. 5.24 Thermal Resistance Characteristics
    25. 5.25 Timing Requirements
    26. 5.26 Switching Characteristics
    27. 5.27 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Low-Power RF eNewsletter
    6. 8.6  Community Resources
    7. 8.7  Additional Information
    8. 8.8  Trademarks
    9. 8.9  Electrostatic Discharge Caution
    10. 8.10 Export Control Notice
    11. 8.11 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
  • RGZ|48
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Device and Documentation Support

8.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2640 is in production; therefore, no prefix/identification is assigned).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RSM).

For orderable part numbers of the CC2640 device in the RSM, RHB or RGZ package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

CC2640 device_nomenclature_CC26xx_SWRS158.gif Figure 8-1 Device Nomenclature

8.2 Tools and Software

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.

The following products support development of the CC2640 device applications:

Software Tools:

SmartRF Studio 7:

SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an early stage in the design process.

  • Test functions for sending and receiving radio packets, continuous wave transmit and receive
  • Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
  • Can also be used without any hardware, but then only to generate, edit and export radio configuration settings
  • Can be used in combination with several development kits for Texas Instruments’ CCxxxx RF-ICs

Sensor Controller Studio:

Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks autonomously and independent of the System CPU state.

  • Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
  • Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine code and associated definitions
  • Allows for rapid development by using the integrated Sensor Controller task testing and debugging functionality. This allows for live visualization of sensor data and algorithm verification.

IDEs and Compilers:

Code Composer Studio:

  • Integrated development environment with project management tools and editor
  • Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
  • Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
  • High integration with TI-RTOS with support for TI-RTOS Object View

IAR Embedded Workbench for ARM

  • Integrated development environment with project management tools and editor
  • IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
  • Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
  • Integrated development environment with project management tools and editor
  • RTOS plugin available for TI-RTOS

For a complete listing of development-support tools for the CC2640 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

8.3 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com (CC2640). In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the CC2640 devices, related peripherals, and other technical collateral is listed in the following.

Technical Reference Manual



8.4 Texas Instruments Low-Power RF Website

Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf.

8.5 Low-Power RF eNewsletter

The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information.

Sign up at: www.ti.com/lprfnewsletter

8.6 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.
    Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:

    • RF circuit, low-power RF, and ZigBee design services
    • Low-power RF and ZigBee module solutions and development tools
    • RF certification services and RF circuit manufacturing

    For help with modules, engineering services or development tools:

    Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork

8.7 Additional Information

Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands.

In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs.

The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world.

With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio.

8.8 Trademarks

SimpleLink, SmartRF, Code Composer Studio, E2E are trademarks of Texas Instruments.

ARM7 is a trademark of ARM Limited (or its subsidiaries).

ARM, Cortex, ARM Thumb are registered trademarks of ARM Limited (or its subsidiaries).

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.

IAR Embedded Workbench is a registered trademark of IAR Systems AB.

IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.

ZigBee is a registered trademark of ZigBee Alliance, Inc.

All other trademarks are the property of their respective owners.

8.9 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.10 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

8.11 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms and definitions.