1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RGZ Package (Top View)
    2. 4.2 Signal Descriptions – RGZ Package
    3. 4.3 Connections for Unused Pins and Modules
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  CCxxxR: ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Supply and Modules
    5. 5.5  Power Consumption - Power Modes
    6. 5.6  Power Consumption - Radio Modes
    7. 5.7  Nonvolatile (Flash) Memory Characteristics
    8. 5.8  Thermal Resistance Characteristics
    9. 5.9  RF Frequency Bands
    10. 5.10 Bluetooth Low Energy - Receive (RX)
    11. 5.11 Bluetooth Low Energy - Transmit (TX)
    12. 5.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    13. 5.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Reset Timing
      2. 5.14.2 Wakeup Timing
      3. 5.14.3 Clock Specifications
        1. 5.14.3.1 48 MHz Bulk Acoustic Wave (BAW) Oscillator
        2. 5.14.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 5.14.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 5.14.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 5.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 5.14.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 5.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 5.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.      
      5. 5.14.5 UART
        1. 5.14.5.1 UART Characteristics
    15. 5.15 Peripheral Characteristics
      1. 5.15.1 ADC
        1. 5.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 5.15.2 DAC
        1. 5.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 5.15.3 Temperature and Battery Monitor
        1. 5.15.3.1 Temperature Sensor
        2. 5.15.3.2 Battery Monitor
      4. 5.15.4 Comparators
        1. 5.15.4.1 Low-Power Clocked Comparator
        2. 5.15.4.2 Continuous Time Comparator
      5. 5.15.5 Current Source
        1. 5.15.5.1 Programmable Current Source
      6. 5.15.6 GPIO
        1. 5.15.6.1 GPIO DC Characteristics
    16. 5.16 Typical Characteristics
      1. 5.16.1 MCU Current
      2. 5.16.2 RX Current
      3. 5.16.3 TX Current
      4. 5.16.4 RX Performance
      5. 5.16.5 TX Performance
      6. 5.16.6 ADC Performance
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  System CPU
    3. 6.3  Radio (RF Core)
      1. 6.3.1 Bluetooth 5.1 Low Energy
      2. 6.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 6.4  Memory
    5. 6.5  Sensor Controller
    6. 6.6  Cryptography
    7. 6.7  Timers
    8. 6.8  Serial Peripherals and I/O
    9. 6.9  Battery and Temperature Monitor
    10. 6.10 µDMA
    11. 6.11 Debug
    12. 6.12 Power Management
    13. 6.13 Clock Systems
    14. 6.14 Network Processor
  7. 7Application, Implementation, and Layout
    1. 7.1 Reference Designs
  8. 8Device and Documentation Support
    1. 8.1 Tools and Software
      1. 8.1.1 SimpleLink™ Microcontroller Platform
    2. 8.2 Documentation Support
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information