SWRS304D October   2024  – November 2025 CC2744R7-Q1 , CC2745P10-Q1 , CC2745R10-Q1 , CC2745R7-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions—RHA Package
    3. 6.3 Connections for Unused Pins and Modules
      1. 6.3.1 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 Peripheral Pin Mapping
      1. 6.4.1 RHA Peripheral Pin Mapping
    5. 6.5 Peripheral Signal Descriptions
      1. 6.5.1 RHA Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes (R variant)
    11. 7.11 Power Consumption–Radio Modes (P variant)
    12. 7.12 Nonvolatile (Flash) Memory Characteristics
    13. 7.13 Thermal Resistance Characteristics
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy—Receive (RX)
    16. 7.16 Bluetooth Low Energy—Transmit (TX)
    17. 7.17 Bluetooth Channel Sounding
    18. 7.18 2.4GHz RX/TX CW
    19. 7.19 Timing and Switching Characteristics
      1. 7.19.1 Reset Timing
      2. 7.19.2 Wakeup Timing
      3. 7.19.3 Clock Specifications
        1. 7.19.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.19.3.2 96MHz RC Oscillator (HFOSC)
        3. 7.19.3.3 80/90/98MHz RC Oscillator (AFOSC)
        4. 7.19.3.4 32kHz Crystal Oscillator (LFXT)
        5. 7.19.3.5 32kHz RC Oscillator (LFOSC)
    20. 7.20 Peripheral Characteristics
      1. 7.20.1 UART
        1. 7.20.1.1 UART Characteristics
      2. 7.20.2 SPI
        1. 7.20.2.1 SPI Characteristics
        2. 7.20.2.2 SPI Controller Mode
        3. 7.20.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.20.2.4 SPI Peripheral Mode
        5. 7.20.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.20.3 I2C
        1. 7.20.3.1 I2C Characteristics
        2. 7.20.3.2 I2C Timing Diagram
      4. 7.20.4 I2S
        1. 7.20.4.1 I2S Controller Mode
        2. 7.20.4.2 I2S Peripheral Mode
      5. 7.20.5 CAN-FD
        1. 7.20.5.1 CAN-FD Characteristics
      6. 7.20.6 GPIO
        1. 7.20.6.1 GPIO DC Characteristics
      7. 7.20.7 ADC
        1. 7.20.7.1 Analog-to-Digital Converter (ADC) Characteristics
      8. 7.20.8 Comparators
        1. 7.20.8.1 Low power comparator
      9. 7.20.9 Voltage Glitch Monitor
    21. 7.21 Typical Characteristics
      1. 7.21.1 MCU Current
      2. 7.21.2 RX Current
      3. 7.21.3 TX Current
      4. 7.21.4 RX Performance
      5. 7.21.5 TX Performance
      6. 7.21.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Memory

The CC27xx devices support up to 1MB of nonvolatile (Flash) memory to provide storage for code and data. The flash memory is in-system programmable and erasable. Dual flash banks (up to 512kB each) are supported to enable reading/execution from one flash bank when erasing/writing to the other flash bank. Special flash memory sectors contain Customer Configuration (CCFG) and Security Configuration (SCFG) sections that are used by system ROM bootcode and TI-provided drivers to configure the device. The CCFG and SCFG configurations are generated using the device configuration Sysconfig tool.

Up to 162KB of ultra-low leakage system static RAM (SRAM) can be used for both storage of data and execution of code. Retention of SRAM contents in Standby power mode is enabled by default and included in Standby mode power consumption numbers. Parity checking for detecting bit errors in memory is an optional feature that is built-in to reduce chip-level soft errors and increase reliability. With the SRAM parity enabled, the SRAM size is limited to 144KB.

Upon regular device boot, the user application can use hardware mechanisms for SRAM clearing. To improve code execution speed and reduce power consumption when executing code from nonvolatile memory, a 4-way set-associative 8KB cache is enabled by default to cache and prefetch instructions read by the system CPU.

The system ROM includes device bootcode firmware that is the first piece of code that executes upon device power-up or reset. The system ROM handles the execution of device start-up routines, initial device trimming, and device security features, including secure boot operations and device lifecycle management. The system ROM also contains a serial (SPI and UART) bootloader that can be used for the initial programming of the device. The system ROM firmware includes open-source MCUBoot software that is licensed under APACHE-2.0. See the corresponding license terms and notice information in Software License and Notice section. Some system ROM firmware is licensed under the BSD-3-clause license.