SWRS224A February   2019  – August 2019 CC3235MODS , CC3235MODSF

PRODUCTION DATA.  

  1. Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 CC3235MODx Pin Diagram
    2. 4.2 Pin Attributes and Pin Multiplexing
      1. Table 4-1 Module Pin Descriptions
    3. 4.3 Signal Descriptions
    4. 4.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    5. 4.5 Pad State After Application of Power to Chip, but Before Reset Release
    6. 4.6 Connections for Unused Pins
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Current Consumption (CC3235MODS)
      1. Table 5-1 Current Consumption Summary (CC3235MODS) 2.4 GHz RF Band
      2. Table 5-2 Current Consumption Summary (CC3235MODS) 5 GHz RF Band
    5. 5.5  Current Consumption (CC3235MODSF)
      1. Table 5-3 Current Consumption Summary (CC3235MODSF) 2.4 GHz RF Band
      2. Table 5-4 Current Consumption Summary (CC3235MODS) 5 GHz RF Band
    6. 5.6  TX Power Control for 2.4 GHz Band
    7. 5.7  TX Power Control for 5 GHz
    8. 5.8  Brownout and Blackout Conditions
    9. 5.9  Electrical Characteristics for GPIO Pins
      1. 5.9.1 GPIO Pins Except 25, 26, 42, and 44 (25°C)
      2. 5.9.2 GPIO Pins 25, 26, 42, and 44 (25°C)
      3. 5.9.3 Pin Internal Pullup and Pulldown (25°C)
    10. 5.10 WLAN Receiver Characteristics
      1. Table 5-6 WLAN Receiver Characteristics: 2.4 GHz Band
      2. Table 5-7 WLAN Receiver Characteristics: 5 GHz Band
    11. 5.11 WLAN Transmitter Characteristics
      1. Table 5-8 WLAN Transmitter Characteristics: 2.4 GHz Band
      2. Table 5-9 WLAN Transmitter Characteristics: 5 GHz Band
    12. 5.12 BLE and WLAN Coexistence Requirements
    13. 5.13 Reset Requirement
    14. 5.14 Thermal Resistance Characteristics for MOB Packages
    15. 5.15 Timing and Switching Characteristics
      1. 5.15.1 Power-Up Sequencing
      2. 5.15.2 Power-Down Sequencing
      3. 5.15.3 Device Reset
      4. 5.15.4 Wake Up From Hibernate Timing
      5. 5.15.5 Peripherals Timing
        1. 5.15.5.1  SPI
          1. 5.15.5.1.1 SPI Master
          2. 5.15.5.1.2 SPI Slave
        2. 5.15.5.2  I2S
          1. 5.15.5.2.1 I2S Transmit Mode
          2. 5.15.5.2.2 I2S Receive Mode
        3. 5.15.5.3  GPIOs
          1. 5.15.5.3.1 GPIO Input Transition Time Parameters
        4. 5.15.5.4  I2C
        5. 5.15.5.5  IEEE 1149.1 JTAG
        6. 5.15.5.6  ADC
        7. 5.15.5.7  Camera Parallel Port
        8. 5.15.5.8  UART
        9. 5.15.5.9  External Flash Interface
        10. 5.15.5.10 SD Host
        11. 5.15.5.11 Timers
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Arm® Cortex®-M4 Processor Core Subsystem
    4. 6.4  Wi-Fi® Network Processor Subsystem
      1. 6.4.1 WLAN
      2. 6.4.2 Network Stack
    5. 6.5  Security
    6. 6.6  FIPS 140-2 Level 1 Certification
    7. 6.7  Power-Management Subsystem
      1. 6.7.1 VBAT Wide-Voltage Connection
    8. 6.8  Low-Power Operating Mode
    9. 6.9  Memory
      1. 6.9.1 Internal Memory
        1. 6.9.1.1 SRAM
        2. 6.9.1.2 ROM
        3. 6.9.1.3 Flash Memory
        4. 6.9.1.4 Memory Map
    10. 6.10 Restoring Factory Default Configuration
    11. 6.11 Boot Modes
      1. 6.11.1 Boot Mode List
    12. 6.12 Hostless Mode
    13. 6.13 Device Certification and Qualification
      1. 6.13.1 FCC Certification and Statement
      2. 6.13.2 IC/ISED Certification and Statement
      3. 6.13.3 ETSI/CE Certification
      4. 6.13.4 MIC Certification
    14. 6.14 Module Markings
    15. 6.15 End Product Labeling
    16. 6.16 Manual Information to the End User
  7. Applications, Implementation, and Layout
    1. 7.1 Typical Application
      1. 7.1.1 BLE/2.4 GHz Radio Coexistence
      2. 7.1.2 Antenna Selection
      3. 7.1.3 Typical Application
    2. 7.2 Device Connection and Layout Fundamentals
      1. 7.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.2.2 Reset
      3. 7.2.3 Unused Pins
    3. 7.3 PCB Layout Guidelines
      1. 7.3.1 General Layout Recommendations
      2. 7.3.2 CC3235MODx RF Layout Recommendations
        1. 7.3.2.1 Antenna Placement and Routing
        2. 7.3.2.2 Transmission Line Considerations
  8. Environmental Requirements and SMT Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 PCB Assembly Guide
      1. 8.4.1 PCB Land Pattern & Thermal Vias
      2. 8.4.2 SMT Assembly Recommendations
      3. 8.4.3 PCB Surface Finish Requirements
      4. 8.4.4 Solder Stencil
      5. 8.4.5 Package Placement
      6. 8.4.6 Solder Joint Inspection
      7. 8.4.7 Rework and Replacement
      8. 8.4.8 Solder Joint Voiding
    5. 8.5 Baking Conditions
    6. 8.6 Soldering and Reflow Condition
  9. Device and Documentation Support
    1. 9.1  Third-Party Products Disclaimer
    2. 9.2  Development Tools and Software
    3. 9.3  Firmware Updates
    4. 9.4  Device Nomenclature
    5. 9.5  Documentation Support
      1. 9.5.1 Support Resources
    6. 9.6  Related Links
    7. 9.7  Trademarks
    8. 9.8  Electrostatic Discharge Caution
    9. 9.9  Export Control Notice
    10. 9.10 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical, Land, and Solder Paste Drawings
    2. 10.2 Package Option Addendum
      1. 10.2.1 Packaging Information
      2. 10.2.2 Tape and Reel Information
        1. 10.2.2.1 CC3235MODx Tape Specifications

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Module Overview