SWRS243B February 2020 – May 2021 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
A uniform PCB plating thickness is key for high assembly yield. For an electroless nickel immersion gold finish, the gold thickness should range from 0.05 µm to 0.20 µm to avoid solder joint embrittlement. Using a PCB with Organic Solderability Preservative (OSP) coating finish is also recommended as an alternative to Ni-Au.