SCHS333B March   2003  – May 2025 CD74AC151

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5V
    7. 4.7 Switching Characteristics, VCC = 3.3V ± 0.3V
    8. 4.8 Switching Characteristics, VCC = 5V ± 0.5V
    9. 4.9 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Balanced CMOS Push-Pull Outputs
      2. 6.3.2 Standard CMOS Inputs
      3. 6.3.3 Clamp Diode Structure
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Power Considerations
        2. 7.2.1.2 Input Considerations
        3. 7.2.1.3 Output Considerations
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

CD74AC151 D, N or PW Packages; 16-Pin SOIC, PDIP or TSSOP (Top View)Figure 3-1 D, N or PW Packages; 16-Pin SOIC, PDIP or TSSOP (Top View)
CD74AC151 BQB Package, 16-Pin WQFN (Transparent Top View)Figure 3-2 BQB Package, 16-Pin WQFN (Transparent Top View)
Pin Functions
PIN I/O(1) DESCRIPTION
NO. NAME
1 D3 I Data input 3
2 D2 I Data input 2
3 D1 I Data input 1
4 D0 I Data input 0
5 Y O Data output
6 W O Data output, inverted
7 G I Output strobe, active low
8 GND G Ground
9 C I Address select C
10 B I Address select B
11 A I Address select A
12 D7 I Data input 7
13 D6 I Data input 6
14 D5 I Data input 5
15 D4 I Data input 4
16 VCC P Positive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power
(2) BQB package only