SCHS285B December   1998  – May 2024 CD54AC541 , CD54ACT540 , CD54ACT541 , CD74AC540 , CD74AC541 , CD74ACT540 , CD74ACT541

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3  Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics, AC Series
    6. 4.6 Electrical Characteristics, ACT Series
    7. 4.7 Switching Characteristics, AC Series
    8. 4.8 Switching Characteristics, ACT Series
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • N|20
  • DW|20
Thermal pad, mechanical data (Package|Pins)

8.5 Electrostatic Discharge Caution

CD74AC540 CD74ACT540 CD54ACT540 CD74AC541 CD54AC541 CD74ACT541 CD54ACT541 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.