SCHS209D November   1998  – December 2024 CD74HC4067 , CD74HCT4067

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Device Functional Modes
  6. 5 Absolute Maximum Ratings
  7. 6 Thermal Information
  8. 7 Recommended Operating Conditions
  9. 8 Electrical Characteristics: HC Devices
  10. 9 Electrical Characteristics: HCT Devices
  11. 10HTC Input Loading
  12. 11Switching Characteristics HC
  13. 12Switching Characteristics HCT
  14. 13Analog Channel Specifications
  15. 14Typical Characteristics
  16. 15Analog Test Circuits
  17. 16Device and Documentation Support
    1. 16.1 Related Documentation
    2. 16.2 Receiving Notification of Documentation Updates
    3. 16.3 Support Resources
    4. 16.4 Trademarks
    5. 16.5 Electrostatic Discharge Caution
    6. 16.6 Glossary
  18. 17Revision History
  19. 18Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|24
  • RGY|24
  • DW|24
  • DB|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Thermal Information

THERMAL METRIC (1) CD74HCx4067 UNIT
E (PDIP) M (SOIC) SM (SSOP) PW (TSSOP)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance  67 84.8 96.2 97.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance N/A  57.0 60.0 45.0 °C/W
RθJB Junction-to-board thermal resistance N/A 59.5 65.1 62.7 °C/W
ΨJT Junction-to-top characterization parameter N/A 29.0 21.1 5.20 °C/W
ΨJB Junction-to-board characterization parameter N/A 59.0 64.4 62.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.