SLPS448F July   2013  – January 2022 CSD13381F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD13381F4 Embossed Carrier Tape Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (October 2021) to Revision F (January 2022)

  • Changed Maximum height from "0.35 mm" to "0.36 mm" in Features Go
  • Changed package height from "0.35 mm" to "0.36 mm" in Typical Device Dimensions Go
  • Changed package height from "0.35 mm" to "0.36 mm" in Mechanical Dimensions Go

Changes from Revision D (May 2015) to Revision E (October 2021)

  • Added footnote with link to support documentGo

Changes from Revision C (September 2014) to Revision D (May 2015)

  • Corrected typo for IGSS Test Condition Go