SLPS220E August   2009  – December 2023 CSD16321Q5

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.2 Thermal Information

TA = 25°C (unless otherwise stated)
PARAMETERMINTYPMAXUNIT
R θJCJunction-to-case thermal resistance(1)1.1°C/W
R θJAJunction-to-ambient thermal resistance(1) (2)50°C/W
(1) RθJC is determined with the device mounted on a 1in2, 2oz Cu pad on a 1.5in × 1.5in, 0.06in thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design.
(2) Device mounted on FR4 Material with 1 in2 of 2oz Cu.
GUID-E74E1E69-7FED-4C50-B3C6-5F28C5F55ADC-low.gif
Max RθJA = 50°C/W when mounted on 1in2 of 2oz Cu.
GUID-FDD3E828-4B59-43EB-A1AA-127166E6B00B-low.gif
Max RθJA = 125°C/W when mounted on minimum pad area of 2oz Cu.