SLPS387C January   2016  – November 2023 CSD17552Q3A

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Support Resources
    2. 5.2 Trademarks
    3. 5.3 Electrostatic Discharge Caution
    4. 5.4 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Junction-to-case thermal resistance(1) 2.3 °C/W
RθJA Junction-to-ambient thermal resistance(1)(2) 60 °C/W
(1) RθJC is determined with the device mounted on a 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches
(3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu.
GUID-B5F1958C-9EBF-44F2-8199-8D7FB867FDDC-low.gif
Max RθJA = 60°C/W when mounted on 1 inch2 (6.45 cm2) of
2 oz. (0.071 mm thick) Cu.
GUID-9AFCC551-1DB2-4CDB-B710-FE83D5804B82-low.gif
Max RθJA = 146°C/W when mounted on a minimum pad area of 2 oz. (0.071 mm thick) Cu.