SLPS638B November   2016  – November 2022 CSD18510KTT

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 KTT Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KTT|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

GUID-27AC647C-9698-472C-9DF2-AFB17897EA08-low.png

Notes:

  1. This package is designed to be soldered to a thermal pad on the board. See PowerPAD™ Thermally Enhanced Package (SLMA002) and PowerPADTM Made Easy (SLMA004) for more information.
  2. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
  3. Board assembly site may have different recommendations for stencil design.