SLPS549B August   2015  – November 2022 CSD19537Q3

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Q3 Package Dimensions

GUID-5C4540EF-B24C-4B5C-84DE-CEADF3E472A4-low.png
DIMMILLIMETERSINCHES
MINNOMMAXMINNOMMAX
A0.9501.0001.1000.0370.0390.043
A10.0000.0000.0500.0000.0000.002
b0.2800.3400.4000.0110.0130.016
b10.310 NOM0.012 NOM
c0.1500.2000.2500.0060.0080.010
D3.2003.3003.4000.1260.1300.134
D21.6501.7501.8000.0650.0690.071
d0.1500.2000.2500.0060.0080.010
d10.3000.3500.4000.0120.0140.016
E3.2003.3003.4000.1260.1300.134
E22.3502.4502.5500.0930.0960.100
e0.650 TYP0.026 TYP
H0.350.4500.5500.0140.0180.022
K0.650 TYP0.026 TYP
L0.350.4500.5500.0140.0180.022
L10000
θ0000