SLPS549B August   2015  – November 2022 CSD19537Q3

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Thermal Information

TA = 25°C (unless otherwise stated)
THERMAL METRICMINTYPMAXUNIT
RθJCJunction-to-case thermal resistance (1)1.5°C/W
RθJAJunction-to-ambient thermal resistance, Note 1 and Note 2(1)(2)55°C/W
(1) RθJC is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu.
GUID-7D276610-944E-4ED2-A8EF-46AA3ECEAEEB-low.gif Max RθJA = 55°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu. GUID-E9F45FC2-7B1C-4A25-9688-912D79E109A5-low.gif Max RθJA = 160°C/W when mounted on a minimum pad area of 2-oz (0.071-mm) thick Cu.