SLPS692C October   2017  – June 2024 CSD25501F3

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJN|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.2 Thermal Information

TA = 25°C (unless otherwise stated)
THERMAL METRICTYPICAL VALUESUNIT
RθJAJunction-to-ambient thermal resistance(1)90°C/W
Junction-to-ambient thermal resistance(2)255°C/W
(1) Device mounted on FR4 material with 1in2 (6.45cm2), 2oz (0.071mm) thick Cu.
(2) Device mounted on FR4 material with minimum Cu mounting area.