SLPS521A December   2014  – May 2024 CSD85301Q2

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Package Dimensions
    2. 7.2 PCB Land Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DLV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRICMINTYPMAXUNIT
RθJAJunction-to-Ambient Thermal Resistance(1)70°C/W
Junction-to-Ambient Thermal Resistance(2)185
(1) Device mounted on FR4 material with 1 inch2 (6.45cm2), 2oz. (0.071mm thick) Cu.
(2) Device mounted on FR4 material with minimum Cu mounting area.

CSD85301Q2
Max RθJA = 70 when mounted on 1 inch2 (6.45cm2) of 2oz.
(0.071mm thick) Cu.
CSD85301Q2
Max RθJA = 185 when mounted on minimum pad area of 2oz.
(0.071mm thick) Cu.