SLPS327B September 2012 – April 2018 CSD86360Q5D
The power block has the ability to utilize the GND planes as the primary thermal path. As such, the use of thermal vias is an effective way to pull away heat from the device and into the system board. Concerns of solder voids and manufacturability problems can be addressed by the use of three basic tactics to minimize the amount of solder attach that will wick down the via barrel:
In the end, the number and drill size of the thermal vias should align with the end user’s PCB design rules and manufacturing capabilities.