SBASAK1A August   2022  – December 2022 DAC82002

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 7.3.1.1 DAC Transfer Function
        2. 7.3.1.2 DAC Register Structure
      2. 7.3.2 Power-On Reset (POR)
      3. 7.3.3 Hardware Reset
      4. 7.3.4 Software Reset
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI)
        1. 7.5.1.1 SYNC Interrupt
    6. 7.6 Register Maps
      1. 7.6.1 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Arbitrary Waveform Generator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Bipolar Analog Output Configuration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1.1 SYNC Interrupt

For SPI operation, the SYNC line stays low for at least 24 falling edges of SCLK, and the addressed DAC register updates on the SYNC rising edge. However, if the SYNC line is brought high before the 24th SCLK falling edge, this event acts as an interrupt to the write sequence. The shift register resets and the write sequence is discarded. As Figure 7-3 shows, the data buffer contents and the DAC register contents do not update, and the operating mode does not change.

Figure 7-3 SYNC Interrupt