10 Revision History
Changes from Revision C (September 2023) to Revision D (March 2024)
- Updated section for inclusive terminology; Added note to Table 4-10.Go
- Changed ESD Ratings table to the automotive format; added
ESD Ratingsspec for ZEK package.Go
- Removed "Advanced Information" comment; Updated footnote 2
exampleGo
- Updated Max current values for VCC1.1 and VCC1.8 total and each
supply inputGo
- Updated Package - Maximum PowerGo
- Updated Section 5.20 for inclusive terminologyGo
- Updated Section 5.21 for inclusive terminologyGo
- Updated Section 7.3.9 for inclusive terminologyGo
- Updated Section 7.3.10 for inclusive terminologyGo
- Added DLPC231 Device Markings.Go
- Updated ZDQ0324A package outline to show alternate mold dimension.;
Added ZEK0324A package outline drawing to support DLPC231-Q1 and
DLPC231S-Q1Go
Changes from Revision B (August 2023) to Revision C (September 2023)
- Updated device name from DLP553x and DLP462x to DLP5530S and
DLP4620S.Go
- Changed
the DMD Pins assignment:
DMD_HS1_WDATA4_P—DMD_HS1_WDATA7_N
for the DLPC231
deviceGo