DLPS253B September   2024  – August 2025 DLPC8445 , DLPC8455

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     6
    2. 4.1  Initialization, Board Level Test, and Debug
    3. 4.2  V-by-One Interface Input Data and Control
    4. 4.3  FPD Link Port(s) Input Data and Control (Not Supported in DLPC8445, DLPC8445V, and DLPC8455)
    5. 4.4  DSI Input Data and Clock (Not Supported in DLPC8445, DLPC8445V, and DLPC8455)
    6. 4.5  DMD SubLVDS Interface
    7. 4.6  DMD Reset and Low-Speed Interfaces
    8. 4.7  Flash Interface
    9. 4.8  Peripheral Interfaces
    10. 4.9  GPIO Peripheral Interface
    11. 4.10 Clock and PLL Support
    12. 4.11 Power and Ground
    13. 4.12 I/O Type Subscript Definition
    14. 4.13 Internal Pullup and Pulldown Characteristics
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2.     22
    3. 5.2  ESD Ratings
    4. 5.3  Recommended Operating Conditions
    5. 5.4  Thermal Information
    6. 5.5  Power Electrical Characteristics
    7. 5.6  Pin Electrical Characteristics
    8. 5.7  DMD SubLVDS Interface Electrical Characteristics
    9.     29
    10. 5.8  DMD Low-Speed Interface Electrical Characteristics
    11.     31
    12. 5.9  V-by-One Interface Electrical Characteristics
    13. 5.10 USB Electrical Characteristics
    14.     34
    15. 5.11 System Oscillator Timing Requirements
    16.     36
    17. 5.12 Power Supply and Reset Timing Requirements
    18.     38
    19. 5.13 V-by-One Interface General Timing Requirements
    20.     40
    21. 5.14 Flash Interface Timing Requirements
    22.     42
    23. 5.15 Source Frame Timing Requirements
    24.     44
    25. 5.16 Synchronous Serial Port Interface Timing Requirements
    26.     46
    27. 5.17 I2C Interface Timing Requirements
    28. 5.18 Programmable Output Clock Timing Requirements
    29. 5.19 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    30.     50
    31. 5.20 DMD Low-Speed Interface Timing Requirements
    32.     52
    33. 5.21 DMD SubLVDS Interface Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 V-by-One Interface
      3. 6.3.3 DMD (SubLVDS) Interface
      4. 6.3.4 Serial Flash Interface
      5. 6.3.5 GPIO Supported Functionality
        1.       63
        2.       64
      6. 6.3.6 Debug Support
  8. 7 Power Supply Recommendations
    1. 7.1 System Power-Up and Power-Down Sequence
    2. 7.2 DMD Fast Park Control (PARKZ)
    3. 7.3 Power Supply Management
    4. 7.4 Hotplug Usage
    5. 7.5 Power Supplies for Unused Input Source Interfaces
    6. 7.6 Power Supplies
      1. 7.6.1 Power Supplies DLPA3085 or DLPA3082
  9. 8 Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Layout Guideline for DLPC8445, DLPC8445V, or DLPC8455 Reference Clock
        1. 8.1.1.1 Recommended Crystal Oscillator Configuration
      2. 8.1.2 V-by-One Interface Layout Considerations
      3. 8.1.3 DMD Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      4. 8.1.4 Power Supply Layout Guidelines
    2. 8.2 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Device Nomenclature
      1. 9.5.1 Device Markings
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
      1. 9.8.1 Video Timing Parameter Definitions
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Thermal Considerations

The underlying thermal requirement for the DLPC8445, DLPC8445V, or DLPC8455 is that the maximum operating junction temperature (TJ) should not be exceeded (defined in the Recommended Operating Conditions). This temperature is dependent on the operating ambient temperature, heatsink, airflow, PCB design (including the component layout density and the amount of copper used), the power dissipation of the DLPC8445, DLPC8445V, or DLPC8455, and the power dissipation of surrounding components. The DLPC8445, DLPC8445V, or DLPC8455’s package is designed to extract heat through the package heat slug to the heatsink, through the thermal balls, and through the power and ground planes of the PCB. Thus, heatsink, copper content, and airflow over the PCB are important factors.

The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and is based on the maximum DLPC8445, DLPC8445V, or DLPC8455 power dissipation and RθJA at 0m/s, 1m/s, and 2m/s of forced airflow, where RθJA is the thermal resistance of the package as measured using the test board described in Layout Guidelines. This test PCB is not necessarily representative of the customer's PCB, and thus, the reported thermal resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best information available during the design phase to estimate thermal performance. TI highly recommends that once the host PCB is designed and built, the thermal performance be measured and validated.

To do this, measure the top center case temperature under the worst-case product scenario (max power dissipation, max voltage, max ambient temperature) and validate that the maximum recommended case temperature (TC) is not exceeded. This specification is based on the measured φJT for the DLPC8445, DLPC8445V, or DLPC8455 package and provides a relatively accurate correlation to junction temperature. Take care when measuring this case temperature to prevent accidental cooling of the package surface. TI recommends a small (approximately 40-gauge) thermocouple. Ensure that the bead and thermocouple wire contact the top of the package. Cover the bead and thermocouple wire with a minimal amount of thermally conductive epoxy. Route the wires closely along the package and the board surface to avoid cooling the bead through the wires.