SNLS742A September 2023 – April 2024 DP83TC811-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DP83TC811-Q1 | UNIT | |
|---|---|---|---|
| VQFN - RHA | |||
| 36 pins | |||
| RθJA | Junction-to-ambient thermal resistance | 33.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 23.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 14.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| YJB | Junction-to-board characterization parameter | 14.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.8 | °C/W |