SLDS227 March   2016 DRV10964

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Sleep Mode
      2. 7.3.2  Speed Input and Control
      3. 7.3.3  Motor Direction Change
      4. 7.3.4  Motor Frequency Feedback (FG)
        1. 7.3.4.1 Tach Feedback During Spin Down
      5. 7.3.5  Lock Detection
        1. 7.3.5.1 Lock0: No Motor
        2. 7.3.5.2 Lock1: Frequency Overflow
        3. 7.3.5.3 Lock2: BEMF Abnormal
          1. 7.3.5.3.1 Lock 3: Accelerate Abnormal
        4. 7.3.5.4 Lock4: Speed Abnormal
      6. 7.3.6  Short Circuit Current Protection
      7. 7.3.7  Anti-Voltage Surge (AVS)
        1. 7.3.7.1 Protecting Against the Return of Mechanical Energy
        2. 7.3.7.2 Protecting Against the Return of Inductive Energy
      8. 7.3.8  Overtemperature Protection
      9. 7.3.9  Undervoltage Protection
      10. 7.3.10 CONFIG Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Spin up Settings
        1. 7.4.1.1 Motor Kt and Rm
        2. 7.4.1.2 Motor Start
        3. 7.4.1.3 Initial Speed Detect (ISD)
        4. 7.4.1.4 Align
        5. 7.4.1.5 Handoff and Closed Loop
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
VCC pin supply voltage –0.3 6 V
Motor phase pins (U, V, W) –1 7.7 V
Direction, speed indicator input, and speed input (FR, FGS, PWM, CONFIG) –0.3 6 V
Speed output (FG) –0.3 7.7 V
TJ Junction temperature –40 150 °C
TSDR Maximum lead soldering temperature, 10 seconds 260 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC VCC pin supply voltage 2.1 5.5 V
U, V, W Motor phase pins –0.7 7 V
FR, FGS, PWM, CONFIG Direction, speed indicator input, and speed input –0.1 5.5 V
FG Speed output –0.1 7.5 V
TJ Junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC (1) DRV10964 UNIT
DSN (USON)
10 PINS
Rθ JA Junction-to-ambient thermal resistance 40.9 °C/W
Rθ JC(top) Junction-to-case (top) thermal resistance 46.6 °C/W
Rθ JB Junction-to-board thermal resistance 15.8 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 16 °C/W
Rθ JC(bot) Junction-to-case (bottom) thermal resistance 2.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

(VCC = 5 V, TA = 25°C unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IVCC Operating current PWM = VCC, no motor connected 6.5 mA
IVCC_SLEEP Sleep current PWM = 0 V 15 20 µA
UVLO
VUVLO_H Undervoltage threshold high 2 2.1 V
VUVLO_L Undervoltage threshold low 1.7 1.8 V
VUVLO_HYS Undervoltage threshold hysteresis 100 200 300 mV
INTEGRATED MOSFET
RDSON Series resistance (H+L) VCC = 5 V; IOUT = 0.5 A 1 1.5 Ω
PWM
VIH_PWM Input high threshold 0.45 × VCC V
VIL_PWM Input low threshold 0.15 × VCC V
FPWM PWM input frequency Duty cycle >0% and <100% 15 100 kHz
RPU_PWM_VCC PWM pin pullup resistor Active mode 40 kΩ
Standby mode 1.5 MΩ
tSLEEP Sleep entry time PWM = 0 V and the motor speed less than 10 Hz 1 ms
FG
IOL_FG FG sink current VFG = 0.3 V 5 mA
ISC_FG FG short circuit current VFG = 5 V 13 25 mA
FGS and FR
VIH_FGS Input high threshold 0.45 × VCC V
VIL_FGS Input low threshold 0.15 × VCC V
VIH_FR Input high threshold 0.45 × VCC V
VIL_FR Input low threshold 0.15 × VCC V
RPU_FGS_VCC FGS pin pullup resistor Active Mode 40 kΩ
Standby Mode 1.5 MΩ
RPU_FR_VCC FR pin pullup resistor 425 kΩ
BEMF COMPARATOR
Voffset Input offset -10 10 mV
VHYS Input hysteresis 14 21 28 mV
Tdelay_r Output delay rising 25-mV step 1.5 μs
Tdelay_f Output delay falling 25-mV step 1.5 μs
Vcom Common mode voltage 0.3 VCC – 0.7 V
RATE LIMITING
tARamp Ramp time for align (from 0 to 50% duty cycle) 300 ms
CONFIG
CONFIGtrip CONFIG pin trip points Handoff speed threshold 87.5 Hz 0 3.1 5.4 % VCC
Handoff speed threshold 12.5 Hz 7.3 9.4 11.7 % VCC
Handoff speed threshold 25 Hz 13.5 15.6 17.9 % VCC
Handoff speed threshold 37.5 Hz 19.8 21.8 24.1 % VCC
Handoff speed threshold 50 Hz 26.0 28.1 30.4 % VCC
Handoff speed threshold 62.5 Hz 32.2 34.4 36.6 % VCC
Handoff speed threshold 75 Hz 38.5 40.6 42.9 % VCC
Handoff speed threshold 87.5 Hz 44.7 46.8 48.9 % VCC
Handoff speed threshold 100 Hz 50.7 53.1 55.1 % VCC
Handoff speed threshold 112.5 Hz 57.0 59.3 61.3 % VCC
Handoff speed threshold 125 Hz 63.2 65.6 67.6 % VCC
Handoff speed threshold 137.5 Hz 69.5 71.9 73.8 % VCC
Handoff speed threshold 150 Hz 75.6 78.1 80.1 % VCC
Handoff speed threshold 162.5 Hz 81.9 84.4 86.3 % VCC
Handoff speed threshold 175 Hz 88.2 90.6 92.6 % VCC
Handoff speed threshold 187.5 Hz 94.5 96.9 100 % VCC
ri CONFIG pin input impedance 10 MΩ
LOCK PROTECTION
tON_LOCK Lock detect time Abnormal Kt lock 0.3 0.33 s
tOFF_LOCK Lock release time 5 5.9 s
SHORT CIRCUIT CURRENT PROTECTION
ISHT Short circuit current protection 1.8 A
THERMAL SHUTDOWN
TSD Thermal shutdown temperature 160 °C
TSD_HYS Thermal shutdown hysteresis 10 °C

6.6 Typical Characteristics

DRV10964 C001_SLAS955.png
Figure 1. RDS(ON) vs Power Supply at 25°C