SLOSE56B May   2020  – May 2022 DRV8426E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Bridge Control
      3. 7.3.3 Current Regulation
      4. 7.3.4 Decay Modes
        1. 7.3.4.1 Mixed Decay
        2. 7.3.4.2 Fast Decay
        3. 7.3.4.3 Smart tune Dynamic Decay
        4. 7.3.4.4 Smart tune Ripple Control
        5. 7.3.4.5 Blanking time
      5. 7.3.5 Charge Pump
      6. 7.3.6 Linear Voltage Regulators
      7. 7.3.7 Logic and Quad-Level Pin Diagrams
        1. 7.3.7.1 nFAULT Pin
      8. 7.3.8 Protection Circuits
        1. 7.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.8.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.8.3 Overcurrent Protection (OCP)
        4. 7.3.8.4 Thermal Shutdown (OTSD)
        5. 7.3.8.5 Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Operating Mode (nSLEEP = 1)
      3. 7.4.3 nSLEEP Reset Pulse
      4. 7.4.4 Functional Modes Summary
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Current Regulation
        2. 8.2.2.2 Power Dissipation and Thermal Calculation
          1. 8.2.2.2.1 Application Curves
    3. 8.3 Alternate Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Current Regulation
        2. 8.3.2.2 Power Dissipation and Thermal Calculation
          1. 8.3.2.2.1 Decay Modes
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range referenced with respect to GND (unless otherwise noted)
MIN MAX UNIT
Power supply voltage (VM) –0.3 35 V
Charge pump voltage (VCP, CPH) –0.3 VVM + 7 V
Charge pump negative switching pin (CPL) –0.3 VVM V
nSLEEP pin voltage (nSLEEP) –0.3 VVM V
Internal regulator voltage (DVDD) –0.3 5.75 V
Control pin voltage (APH, AEN, BPH, BEN, AIN1, AIN2, BIN1, BIN2, nFAULT, ADECAY, BDECAY, TOFF) –0.3 5.75 V
Open drain output current (nFAULT) 0 10 mA
Reference input pin voltage (VREFA, VREFB) –0.3 5.75 V
Continuous phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2) –1 VVM + 1 V
Transient 100 ns phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2) –3 VVM + 3 V
Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2) Internally Limited A
Operating ambient temperature, TA –40 125 °C
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.