SLOS629D July   2010  – October 2016 DRV8601

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Support for ERM and LRA Actuators
      2. 7.3.2 Internal Reference
      3. 7.3.3 Shutdown Mode
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Pseudo-Differential Feedback with Internal Reference
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Pseudo-Differential Feedback with Level-Shifter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Differential Feedback With External Reference
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Selecting Components
            1. 8.2.3.2.1.1 Resistors RI and RF
            2. 8.2.3.2.1.2 Capacitor CR
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, TA ≤ 25°C (unless otherwise noted)(1)
MIN MAX UNIT
VDD Supply voltage –0.3 6 V
VI Input voltage, INx, EN –0.3 VDD + 0.3 V
Output continuous total power dissipation See Thermal Information
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VDD Supply voltage 2.5 5.5 V
VIH High-level input voltage EN 1.15 V
VIL Low-level input voltage EN 0.5 V
TA Operating free-air temperature –40 85 °C
ZL Load impedance 6.4 Ω

6.4 Thermal Information

THERMAL METRIC(1) DRV8601 UNIT
DRB ZQV
8 PINS 8 BALLS
RθJA Junction-to-ambient thermal resistance 52.8 78 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63 155 °C/W
RθJB Junction-to-board thermal resistance 28.4 65 °C/W
ψJT Junction-to-top characterization parameter 2.7 5 °C/W
ψJB Junction-to-board characterization parameter 28.6 50 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.4 n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at TA = 25°C, Gain = 2 V/V, RL= 10 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOO| Output offset voltage
(measured differentially)		 VI = 0 V, VDD = 2.5 V to 5.5 V 9 mV
VOD,N Negative differential output voltage
(VOUT+–VOUT–)		 VIN+ = VDD, VIN– = 0 V or
VIN+ = 0 V, VIN– = VDD 		VDD = 5.0 V, Io = 400 mA –4.55 V
VDD = 3.3 V, Io = 300 mA –2.87
VDD = 2.5 V, Io = 200 mA –2.15
VOD,P Positive differential output voltage
(VOUT+–VOUT–)		 VIN+ = VDD, VIN– = 0 V or
VIN+ = 0 V, VIN– = VDD 		VDD = 5.0 V, Io = 400 mA 4.55 V
VDD = 3.3 V, Io = 300 mA 2.87
VDD = 2.5 V, Io = 200 mA 2.15
|IIH| High-level EN input current VDD = 5.5 V, VI = 5.8 V 1.2 μA
|IIL| Low-level EN input current VDD = 5.5 V, VI = –0.3 V 1.2 μA
IDD(Q) Supply current VDD = 2.5 V to 5.5 V, No load, EN = VIH 1.7 2 mA
IDD(SD) Supply current in shutdown mode EN = VIL, VDD = 2.5 V to 5.5 V, No load 0.01 0.9 μA

6.6 Operating Characteristics

at TA = 25°C, Gain = 2 V/V, RL = 10 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ZI Input impedance 2 MΩ
ZO Output impedance Shutdown mode (EN = VIL) >10 kΩ

6.7 Typical Characteristics

Table 1. Table of Graphs

FIGURE
Output voltage (High) vs Load current Figure 1
Output voltage (Low) vs Load current Figure 2
Output voltage vs Input voltage, RL = 10 Ω Figure 3
Output voltage vs Input voltage, RL = 20 Ω Figure 4
Supply current vs Supply voltage Figure 5
Shutdown supply current vs Supply voltage Figure 6
Power dissipation vs Supply voltage Figure 7
Slew rate vs Supply voltage Figure 8
Output transition vs Time Figure 9, Figure 10
Startup vs Time Figure 11
Shutdown vs Time Figure 12
DRV8601 tc1_vo_il_posi_los629.gif
Figure 1. Output Voltage (High) vs Load Current
DRV8601 tc3_vo_vi_10_los629.gif
Figure 3. Output Voltage vs Input Voltage
DRV8601 tc5_sc_sv_ena_los629.gif
Figure 5. Supply Current vs Supply Voltage
DRV8601 tc7_pdis_sv_los629.gif
Figure 7. Power Dissipation vs Supply Voltage
DRV8601 tc9_otr_time_3p3_los629.gif
Figure 9. Output Transition vs Time
DRV8601 tc11_stupt_3p3_los629.gif
Figure 11. Startup vs Time
DRV8601 tc2_vo_il_nega_los629.gif
Figure 2. Output Voltage (Low) vs Load Current
DRV8601 tc4_vo_vi_20_los629.gif
Figure 4. Output Voltage vs Input Voltage
DRV8601 tc6_sdsc_sv_los629.gif
Figure 6. Shutdown Supply Current vs Supply Voltage
DRV8601 tc8_sr_sv_rise_los629.gif
Figure 8. Slew Rate vs Supply Voltage
DRV8601 tc10_outt_time_5V_los629.gif
Figure 10. Output Transition vs Time
DRV8601 tc12_sd_time_3p3_los629.gif
Figure 12. Shutdown vs Time