SLVSD18C June   2015  – August 2017 DRV8880

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified System Diagram
      2.      Microstepping Current Waveform
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Current Regulation
      5. 7.3.5  Decay Modes
        1. 7.3.5.1 Mode 1: Slow Decay for Increasing and Decreasing Current
        2. 7.3.5.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing current
        3. 7.3.5.3 Mode 3: Mixed Decay for Increasing and Decreasing Current
        4. 7.3.5.4 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        5. 7.3.5.5 Mode 5: Fast Decay for Increasing and Decreasing Current
      6. 7.3.6  Smart Tune
      7. 7.3.7  Adaptive Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  LDO Voltage Regulator
      10. 7.3.10 Logic and Tri-Level Pin Diagrams
      11. 7.3.11 Power Supplies and Input Pins
      12. 7.3.12 Protection Circuits
      13. 7.3.13 VM UVLO (UVLO2)
      14. 7.3.14 Logic Undervoltage (UVLO1)
      15. 7.3.15 VCP Undervoltage Lockout (CPUV)
      16. 7.3.16 Thermal Shutdown (TSD)
      17. 7.3.17 Overcurrent Protection (OCP)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
        4. 8.2.2.4 Sense Resistor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHR|28
  • PWP|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range referenced with respect to GND (unless otherwise noted) (1)
MIN MAX UNIT
Power supply voltage (VM) –0.3 50 V
Power supply voltage ramp rate (VM) 0 2 V/µs
Charge pump voltage (VCP, CPH) –0.3 VM + 12 V
Charge pump negative switching pin (CPL) –0.3 VM V
Internal regulator voltage (V3P3) –0.3 3.8 V
Internal regulator current output (V3P3) 0 10 mA
Control pin voltage (STEP, DIR, ENABLE, nSLEEP, nFAULT, M0, M1, DECAY0, DECAY1, TRQ0, TRQ1, ATE) –0.3 7.0 V
Open drain output current (nFAULT) 0 10 mA
Reference input pin voltage (VREF) –0.3 4.1 V
Continuous phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2) –0.7 VM + 0.7 V
Continuous shunt amplifier input pin voltage (AISEN, BISEN) (2) –0.55 0.55 V
Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2, AISEN, BISEN) Internally limited A
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transients of ±1 V for less than 25 ns are acceptable