SNLS733A December   2022  – October 2023 DS560MB410

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Description (Continued)
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Description (Continued)

The DS560MB410 includes a full 2×2 crosspoint between each pair of adjacent channels to enable 2-to-1 multiplexing and 1-to-2 de-multiplexing for failover redundancy, 1-to-2 fanout for diagnostic monitoring, and signal crossover (NRZ only up to 32 GBd) for PCB routing flexibility. The crosspoint is controllable through pins or the SMBus register interface.

The DS560MB410’s small package dimensions and optimized high-speed signal escape are an excellent choice for small form-factor applications. Simplified equalization control, low power consumption, and ultra-low additive jitter make it suitable for chip-to-chip reach extension and signal distribution over backplanes and midplanes. The small 6.00 mm × 6.00 mm footprint easily fits in active copper cable (ACC) assembly applications without the need for a heat sink.

The DS560MB410 has a single power supply and minimal need for external components. These features reduce PCB routing complexity and bill of materials (BOM) cost. The DS560MB410 can be configured through SMBus or through an external EEPROM. Up to 16 devices can share a single EEPROM.