SLVSJG1 August 2026 ESD551
PRODUCTION DATA
- 1
- 1Features
- 2Applications
- 3Description
- 4Pin Configuration and Functions
- 5Specifications
- 6Device and Documentation Support
- 7Revision History
- 8Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DPY|2
Thermal pad, mechanical data (Package|Pins)
- DPY|2
Orderable Information
5.7 Typical Characteristics
Figure 5-1 Positive TLP Curve
Figure 5-2 Negative TLP Curve
Figure 5-3 +8kV Clamped IEC Waveform
Figure 5-4 -8kV Clamped IEC Waveform
Figure 5-5 Capacitance vs Bias Voltage
Figure 5-6 Capacitance vs Temperature
Figure 5-7 Leakage vs Temperature
Figure 5-8 DC-IV Curve