SLVSJ54A December   2025  – December 2025 ESD752

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—IEC Specification
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Detailed Design Procedure
  8. 7 Layout
    1. 7.1 Layout Guidelines
    2. 7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

ESD752 DXA Package, 3-Pin DFN1110 (Bottom View)Figure 4-1 DXA Package, 3-Pin DFN1110 (Bottom View)
ESD752 DBZ & DCK Package, 3-Pin SOT-23 & SOT SC70 (Top View)Figure 4-2 DBZ & DCK Package, 3-Pin SOT-23 & SOT SC70 (Top View)
Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
IO1, 2I/OESD protected IO
GND3GConnect to ground.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power