Home Interface Diodes ESD protection diodes

ESD752

ACTIVE

Dual, 3-pF, ±24-V, ±30-kV ESD protection diode with 8/20-µS surge

Product details

Package name SOT-23, SOT-SC70 Peak pulse power (8/20 μs) (max) (W) 210 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 3 Clamping voltage (V) 35 Breakdown voltage (min) (V) 25.5
Package name SOT-23, SOT-SC70 Peak pulse power (8/20 μs) (max) (W) 210 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 3 Clamping voltage (V) 35 Breakdown voltage (min) (V) 25.5
SOT-23 (DBZ) 3 6.9204 mm² 2.92 x 2.37 SOT-SC70 (DCK) 3 4.2 mm² 2 x 2.1
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 5.7 A or 2.5 A
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV or ±20-kV contact discharge
    • ±30-kV or ±20-kV air-gap discharge
  • 24 V working voltage
  • Bidirectional ESD protection
  • 2-channel device provides complete ESD and surge protection with single component
  • Low clamping voltage protects downstream components
  • I/O capacitance = 3 pF or 1.7 pF (typical)
  • SOT-23 (DBZ) small, standard, common footprint
  • SOT-323 / SC-70 (DCK) very small, standard, space saving, common footprint
  • Leaded packages used for automatic optical inspection (AOI)
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 5.7 A or 2.5 A
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV or ±20-kV contact discharge
    • ±30-kV or ±20-kV air-gap discharge
  • 24 V working voltage
  • Bidirectional ESD protection
  • 2-channel device provides complete ESD and surge protection with single component
  • Low clamping voltage protects downstream components
  • I/O capacitance = 3 pF or 1.7 pF (typical)
  • SOT-23 (DBZ) small, standard, common footprint
  • SOT-323 / SC-70 (DCK) very small, standard, space saving, common footprint
  • Leaded packages used for automatic optical inspection (AOI)

The ESD752 and ESD762 are bidirectional ESD protection diodes for USB power delivery (USB-PD) and industrial interfaces. The ESD752 and ESD762 are rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±30-kV or ±20-kV contact and ±30-kV or ±20-kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.

These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 5.7 A (8/20 µs surge waveform) capability of the ESD752 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 3 pF or 1.7 pF line capacitance of the ESD752 and ESD762 are suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.

The ESD752 and ESD762 are offered in two leaded packages for easy flow through routing.

The ESD752 and ESD762 are bidirectional ESD protection diodes for USB power delivery (USB-PD) and industrial interfaces. The ESD752 and ESD762 are rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±30-kV or ±20-kV contact and ±30-kV or ±20-kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.

These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 5.7 A (8/20 µs surge waveform) capability of the ESD752 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 3 pF or 1.7 pF line capacitance of the ESD752 and ESD762 are suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.

The ESD752 and ESD762 are offered in two leaded packages for easy flow through routing.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet ESD752 and ESD762 24-V, 2-Channel, ESD Protection With 5.7 A of 8/20 µsSurge Protection in a SOT-23 and SOT-323 / SC-70 Package datasheet (Rev. B) PDF | HTML 22 Nov 2022
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — Generic ESD Evaluation Module

Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For (...)
User guide: PDF | HTML
Not available on TI.com
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Package Pins Download
SOT-23 (DBZ) 3 View options
SOT-SC70 (DCK) 3 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos