SNOSCZ9 May   2016 FDC2112-Q1 , FDC2114-Q1 , FDC2212-Q1 , FDC2214-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics - I2C
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Clocking Architecture
      2. 7.3.2 Multi-Channel and Single-Channel Operation
        1. 7.3.2.1 Gain and Offset (FDC2112, FDC2114 only)
      3. 7.3.3 Current Drive Control Registers
      4. 7.3.4 Device Status Registers
      5. 7.3.5 Input Deglitch Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-Up Mode
      2. 7.4.2 Normal (Conversion) Mode
      3. 7.4.3 Sleep Mode
      4. 7.4.4 Shutdown Mode
        1. 7.4.4.1 Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface Specifications
    6. 7.6 Register Maps
      1. 7.6.1  Register List
      2. 7.6.2  Address 0x00, DATA_CH0
      3. 7.6.3  Address 0x01, DATA_LSB_CH0 (FDC2212 / FDC2214 only)
      4. 7.6.4  Address 0x02, DATA_CH1
      5. 7.6.5  Address 0x03, DATA_LSB_CH1 (FDC2212 / FDC2214 only)
      6. 7.6.6  Address 0x04, DATA_CH2 (FDC2114, FDC2214 only)
      7. 7.6.7  Address 0x05, DATA_LSB_CH2 (FDC2214 only)
      8. 7.6.8  Address 0x06, DATA_CH3 (FDC2114, FDC2214 only)
      9. 7.6.9  Address 0x07, DATA_LSB_CH3 (FDC2214 only)
      10. 7.6.10 Address 0x08, RCOUNT_CH0
      11. 7.6.11 Address 0x09, RCOUNT_CH1
      12. 7.6.12 Address 0x0A, RCOUNT_CH2 (FDC2114, FDC2214 only)
      13. 7.6.13 Address 0x0B, RCOUNT_CH3 (FDC2114, FDC2214 only)
      14. 7.6.14 Address 0x0C, OFFSET_CH0 (FDC21112 / FDC2114 only)
      15. 7.6.15 Address 0x0D, OFFSET_CH1 (FDC21112 / FDC2114 only)
      16. 7.6.16 Address 0x0E, OFFSET_CH2 (FDC2114 only)
      17. 7.6.17 Address 0x0F, OFFSET_CH3 (FDC2114 only)
      18. 7.6.18 Address 0x10, SETTLECOUNT_CH0
      19. 7.6.19 Address 0x11, SETTLECOUNT_CH1
      20. 7.6.20 Address 0x12, SETTLECOUNT_CH2 (FDC2114, FDC2214 only)
      21. 7.6.21 Address 0x13, SETTLECOUNT_CH3 (FDC2114, FDC2214 only)
      22. 7.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
      23. 7.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
      24. 7.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (FDC2114, FDC2214 only)
      25. 7.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (FDC2114, FDC2214 only)
      26. 7.6.26 Address 0x18, STATUS
      27. 7.6.27 Address 0x19, ERROR_CONFIG
      28. 7.6.28 Address 0x1A, CONFIG
      29. 7.6.29 Address 0x1B, MUX_CONFIG
      30. 7.6.30 Address 0x1C, RESET_DEV
      31. 7.6.31 Address 0x1E, DRIVE_CURRENT_CH0
      32. 7.6.32 Address 0x1F, DRIVE_CURRENT_CH1
      33. 7.6.33 Address 0x20, DRIVE_CURRENT_CH2 (FDC2114 / FDC2214 only)
      34. 7.6.34 Address 0x21, DRIVE_CURRENT_CH3 (FDC2114 / FDC2214 only)
      35. 7.6.35 Address 0x7E, MANUFACTURER_ID
      36. 7.6.36 Address 0x7F, DEVICE_ID
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Sensor Configuration
      2. 8.1.2 Shield
      3. 8.1.3 Power-Cycled Applications
      4. 8.1.4 Inductor Self-Resonant Frequency
      5. 8.1.5 Application Curves for Proximity Sensing
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plot
      4. 8.2.4 Recommended Initial Register Configuration Values
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Related Links
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

For related links, see the following:

Texas Instruments' WEBENCH® tool: http://www.ti.com/webench

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, refer to the following:

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953)

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 48. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
FDC2112-Q1 Click here Click here Click here Click here Click here
FDC2114-Q1 Click here Click here Click here Click here Click here
FDC2212-Q1 Click here Click here Click here Click here Click here
FDC2214-Q1 Click here Click here Click here Click here Click here

11.5 Trademarks

E2E is a trademark of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.