SNAS685A May 2016 – August 2016 HDC1010
The Relative Humidity sensor element is located on the bottom side of the package. It is positioned between the two rows of bumps
It is recommended to not route any traces below the sensor element. Moreover the external components, such as pull-up resistors and bypass capacitors need to be placed next to the 2 rows of bumps or on the bottom side of the PCB in order to guarantee a good air flow.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device (GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.
Two types of PCB land patterns are used for surface mount packages:
Pros and cons of NSMD and SMD:
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent on the temperature, the HDC1010 should be positioned away from hot points present on the board such as battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a quicker response to environmental changes.