SNAS693D July 2017 – February 2021 HDC2010
PRODUCTION DATA
To improve measurement accuracy, TI recommends to isolate the HDC2010 from all heat sources in the form of active circuitry, batteries, displays and resistive elements. If design space is a constraint, cutouts surrounding the device or the inclusion of small trenches can help minimize heat transfer from PCB heat sources to the HDC2010. To avoid self-heating the HDC2010, TI recommends to configure the device for a maximum sample rate of 1 Hz (1sps).