SNAS778C June   2021  – December 2022 HDC3020 , HDC3021 , HDC3022

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Factory Installed Polyimide Tape
      2. 8.3.2  Factory Installed IP67 Protection Cover
      3. 8.3.3  Measurement of Relative Humidity and Temperature
      4. 8.3.4  Offset Error Correction: Accuracy Restoration
      5. 8.3.5  NIST Traceability of Relative Humidity and Temperature Sensor
      6. 8.3.6  Measurement Modes: Trigger-On Demand vs Auto Measurement
      7. 8.3.7  Heater
      8. 8.3.8  ALERT Output With Programmable Interrupts
      9. 8.3.9  Checksum Calculation
      10. 8.3.10 Programmable Offset of Relative Humidity and Temperature Results
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 I2C Serial Bus Address Configuration
      3. 8.5.3 I2C Write - Send Device Command
      4. 8.5.4 I2C Read - Retrieve Single Data Result
      5. 8.5.5 I2C Read - Retrieve Multi Data Result
      6. 8.5.6 I2C Repeated START - Send Command and Retrieve Data Results
      7. 8.5.7 Command Table and Detailed Description
        1. 8.5.7.1 Reset
          1. 8.5.7.1.1 Soft Reset
          2. 8.5.7.1.2 I2C General Call Reset
        2. 8.5.7.2 Trigger-On Demand
        3. 8.5.7.3 Auto Measurement Mode
          1. 8.5.7.3.1 Auto Measurement Mode: Enable and Configure Measurement Interval
          2. 8.5.7.3.2 Auto Measurement Mode: Measurement Readout
          3. 8.5.7.3.3 Auto Measurement Mode: Exit
          4. 8.5.7.3.4 Auto Measurement Mode: Measurement History Readout
          5. 8.5.7.3.5 Override Default Device Power-On and Device-Reset State
        4. 8.5.7.4 ALERT Output Configuration
          1. 8.5.7.4.1 ALERT Output: Environmental Tracking of Temperature and Relative Humidity
          2. 8.5.7.4.2 ALERT Output: Representation of Environmental Thresholds and Default Threshold Values
          3. 8.5.7.4.3 ALERT Output: Steps to Calculate and Program Environmental Thresholds
          4. 8.5.7.4.4 ALERT Output: Deactivation of Environmental Tracking
          5. 8.5.7.4.5 ALERT Output: Transfer Thresholds into Non-Volatile Memory
        5. 8.5.7.5 Programmable Measurement Offset
          1. 8.5.7.5.1 Representation of Offset Value and Factory Shipped Default Value
          2. 8.5.7.5.2 Factory Shipped Default Offset Values
          3. 8.5.7.5.3 Calculate Relative Humidity Offset Value
          4. 8.5.7.5.4 Calculate Temperature Offset Value
          5. 8.5.7.5.5 Write an Offset Value
          6. 8.5.7.5.6 Verify a Programmed Offset Value
        6. 8.5.7.6 Status Register
        7. 8.5.7.7 Heater: Enable and Disable
        8. 8.5.7.8 Heater: Configure Level of Heater Current
        9. 8.5.7.9 Read NIST ID/Serial Number
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Storage and PCB Assembly
        1. 9.4.3.1 Storage and Handling
        2. 9.4.3.2 Soldering Reflow
        3. 9.4.3.3 Rework
        4. 9.4.3.4 Exposure to High Temperature and High Humidity Conditions
        5. 9.4.3.5 Bake/Rehydration Procedure
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1 Factory Installed Polyimide Tape

The HDC3021 has a polyimide tape to cover the opening of the humidity sensor element. The tape protects the humidity sensor element from pollutants that can be produced as part of the manufacturing process, such as SMT assembly, printed circuit board (PCB) wash, and conformal coating. The tape must be removed after the final stages of assembly for accurate measurement of relative humidity in the ambient environment. The tape can withstand at least three standard reflow cycles.

To remove the polyimide tape from the humidity sensor element, TI recommends to use a ESD-safe tweezer to grip the adhesive-free tab in the top right corner, and slowly peel the adhesive from the top-right corner towards the bottom-left corner in an upward direction (as opposed to across the surface). This will help to reduce the risk of scratching the humidity sensor element.