SNAS817C June 2021 – March 2023 HDC3020-Q1 , HDC3021-Q1 , HDC3022-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
It is generally best practice to solder the package thermal pad to a board pad that is connected to ground as is shown in the layout example. To minimize thermal mass for maximum heater efficiency or to measure ambient temperature, however, the pad may be left floating. Floating the thermal pad is an option because the thermal pad has a non-conductive epoxy.