SBOS472B March   2009  – June 2016 INA148-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics Dual Supply
    6. 6.6 Electrical Characteristics Single Supply
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Gain Equation
      3. 7.3.3 Common-Mode Range
      4. 7.3.4 Offset Trim
      5. 7.3.5 Input Impedance
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Battery Monitor Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Quasi-AC-Coupled Differential Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Single-Supply Differential Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 AC-Coupled Difference Amplifier
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
      5. 8.2.5 50-mV Current-Shunt Amplifier With ±200-V Common-Mode Voltage Range
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage V+ to V– 36 V
Input voltage Continuous ±200 V
Peak (0.1 s) ±500
Short circuit to ground duration Continuous
Package thermal impedance, junction to free air 97.1 °C/W
Operating free-air temperature –40 125 °C
Maximum operating virtual-junction temperature 150 °C
Lead temperature (soldering, 10 s) 300 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±1500 V
Charged-device model (CDM), per AEC Q100-011 ±2000
Machine model ±150
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VS Supply voltage Single supply 2.7 36 V
Dual supply ±1.35 ±18
TA Operating free-air temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) INA148-Q1 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 100.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 44.9 °C/W
RθJB Junction-to-board thermal resistance 42.2 °C/W
ψJT Junction-to-top characterization parameter 6.3 °C/W
ψJB Junction-to-board characterization parameter 41.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics Dual Supply

VS = ±5 V to ±15 V (dual supply), RL = 10 kΩ to ground, VREF = 0 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOS Input offset voltage(1)(2) VCM = 0 V VS = ±15 V ±1 ±5 mV
VS = ±5 V ±1 ±5
ΔVOS/ΔT Input offset voltage drift(1) TA = –40°C to 125°C ±10 μV/°C
PSRR Power supply ripple rejection(1) VS = ±1.35 V to ±18 V, VCM = 0 V ±50 ±400 μV/V
VCM Common-mode voltage range V+IN – V–IN = 0 VS = ±15 V –200 200 V
VS = ±5 V –100 80
CMRR Common-mode rejection ratio VS = ±15 V, VCM = –200 V to 200 V, RS = 0 Ω 70 86 dB
VS = ±5 V, VCM = –100 V to 80 V, RS = 0 Ω 70 86
Differential input impedance 2
Common-mode input impedance 1
Vn Voltage noise(1)(3) f = 0.1 Hz to 10 Hz 17 μVp-p
Voltage noise density(1)(3) f = 1 kHz 880 nV/√Hz
Initial gain(1) 1 V/V
Gain error VO = (V– + 0.5) to (V+ – 1.5) ±0.01% ±0.075%
Gain error over temperature ±3 ±10 ppm/°C
Gain nonlinearity VO = (V– + 0.5) to (V+  1.5) VS = ±15 V ±0.001 ±0.002 %FSR
VS = ±5 V ±0.001
Small-signal bandwidth frequency response 100 kHz
SR Slew rate 1 V/μs
ts Settling time VS = ±15 V, 10-V step 0.1% 21 μs
0.01% 25
VS = ±5 V, 6-V step 0.1% 21
0.01% 25
Overload recovery 50% input overload 24 μs
VO Output voltage RL = 100 kΩ V– + 0.25 V+ – 1 V
RL = 10 kΩ V– + 0.5 V+ – 1.5
IO Output current Short-circuit current, continuous to common ±13 mA
CL Load capacitance Stable operation 10 nF
IS Supply current VIN = 0, IO = 0 ±260 ±300 μA
(1) Overall difference amplifier configuration. Referred to input pins (V+IN and V–IN ), gain = 1 V/V.
(2) Includes effects of amplifier's input bias and offset currents.
(3) Includes effects of input current noise and thermal noise contribution of resistor network.

6.6 Electrical Characteristics Single Supply

VS = 5 V (single supply), RL = 10 kΩ to VS / 2, VREF = VS / 2, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOS Input offset voltage(1)(2) VCM = VS / 2 ±1 ±5 mV
ΔVOS/ΔT Input offset voltage drift(1) TA = –40°C to 125°C ±10 μV/°C
PSRR Power supply ripple rejection(1) VS = 2.7 V to 36 V, VCM = VS / 2 ±50 ±400 μV/V
VCM Common-mode voltage range V+IN – V–IN = 0 VREF = 0.25 V –4 75 V
VREF = VS / 2 –47.5 32.5
CMRR Common-mode rejection ratio VCM = –47.5 V to 32.5 V, RS = 0 Ω 70 86 dB
Differential input impedance 2
Common-mode input impedance 1
Vn Voltage noise(1)(3) f = 0.1 Hz to 10 Hz 17 μVp-p
Voltage noise density(1)(3) f = 1 kHz 880 nV/√Hz
Initial gain(1) 1 V/V
Gain error VO = 0.5 V to 3.5 V ±0.01% ±0.075%
Gain error over temperature ±3 ±10 ppm/°C
Gain nonlinearity VO = 0.5 V to 3.5 V ±0.001 %FSR
Small-signal bandwidth 100 kHz
SR Slew rate 1 V/μs
ts Settling time VS = 5 V, 3-V step 0.1% 21 μs
0.01% 25
Overload recovery 50% input overload 13 μs
VO Output voltage RL = 100 kΩ V– + 0.25 V+ – 1 V
RL = 10 kΩ V– + 0.5 V+ – 1.5
IO Output current Short-circuit current, continuous to common ±8 mA
CL Load capacitance Stable operation 10 nF
IQ Quiescent current VIN = 0, IO = 0 260 300 μA
(1) Overall difference amplifier configuration. Referred to input pins (V+IN and V–IN ), gain = 1 V/V.
(2) Includes effects of amplifier's input bias and offset currents.
(3) Includes effects of input current noise and thermal noise contribution of resistor network.

6.7 Typical Characteristics

VS = ±15 V, RL = 10 kΩ to common, VREF = 0 V, TA = 25°C (unless otherwise noted)
INA148-Q1 typchar_1_1_bos472.gif Figure 1. Gain vs Frequency
INA148-Q1 typchar_1_3_bos472.gif Figure 3. Power Supply Rejection vs Frequency
INA148-Q1 typchar_1_5_bos472.gif
Figure 5. Voltage Noise (RTI)
INA148-Q1 typchar_2_1_bos472.gif Figure 7. Short-Circuit Current vs Temperature
INA148-Q1 typchar_2_3_bos472.gif
Figure 9. Output Voltage Swings vs RL
INA148-Q1 typchar_2_5_bos472.gif
RL = 10 kΩ CL = 10 pF
Figure 11. Small-Signal Step Response
INA148-Q1 typchar_3_1_bos472.gif Figure 13. Offset Voltage Production Distribution
INA148-Q1 typchar_3_3_bos472.gif Figure 15. Offset Voltage Drift Production Distribution
INA148-Q1 typchar_3_5_bos472.gif Figure 17. Gain Drift Production Distribution
INA148-Q1 typchar_4_1_bos472.gif Figure 19. Inverting Input 50% Overload Recovery Time
INA148-Q1 typchar_1_2_bos472.gif Figure 2. Common-Mode Rejection vs Frequency
INA148-Q1 typchar_1_4_bos472.gif Figure 4. Input Voltage Noise Spectral Density
INA148-Q1 typchar_1_6_bos472.gif Figure 6. Quiescent Current vs Temperature
INA148-Q1 typchar_2_2_bos472.gif Figure 8. Large-Signal Step Response vs Temperature
INA148-Q1 typchar_2_4_bos472.gif
RL = 10 kΩ CL = 10 pF
Figure 10. Large-Signal Step Response
INA148-Q1 typchar_2_6_bos472.gif
CL = 1 nF and 10 nF
Figure 12. Large-Signal Capacitive Load Response
INA148-Q1 typchar_3_2_bos472.gif Figure 14. Offset Voltage Production Distribution
INA148-Q1 typchar_3_4_bos472.gif Figure 16. Offset Voltage Drift Production Distribution
INA148-Q1 typchar_3_6_bos472.gif Figure 18. Gain Drift Production Distribution
INA148-Q1 typchar_4_2_bos472.gif Figure 20. Noninverting Input 50% Overload Recovery Time