SBOS539A December   2010  – April 2016 INA203-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Current-Shunt Monitor
    6. 7.6 Electrical Characteristics: Comparator
    7. 7.7 Electrical Characteristics: Reference
    8. 7.8 Electrical Characteristics: General
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Comparator
      2. 8.3.2 Comparator Delay
      3. 8.3.3 Comparator Maximum Input Voltage Range
      4. 8.3.4 Reference
      5. 8.3.5 Output Voltage Range
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 Selecting RSHUNT
      3. 9.1.3 Input Filtering
      4. 9.1.4 Accuracy Variations as a Result of VSENSE and Common-Mode Voltage
        1. 9.1.4.1 Normal Case 1: VSENSE ≥ 20 mV, VCM ≥ VS
        2. 9.1.4.2 Normal Case 2: VSENSE ≥ 20 mV, VCM < VS
        3. 9.1.4.3 Low VSENSE Case 1:
        4. 9.1.4.4 Low VSENSE Case 2: VSENSE < 20 mV, 0 V ≤ VCM ≤ VS
      5. 9.1.5 Transient Protection
    2. 9.2 Typical Applications
      1. 9.2.1 Polyswitch Warning and Fault Detection Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Lead-Acid Battery Protection Circuit
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

  • Connect the input pins to the sensing resistor using a Kelvin or 4-wire connection. This connection technique ensures that only the current-sensing resistor impedance is detected between the input pins. Poor routing of the current-sensing resistor commonly results in additional resistance present between the input pins. Given the very low ohmic value of the current resistor, any additional high-current carrying impedance can cause significant measurement errors.
  • The power-supply bypass capacitor should be placed as closely as possible to the supply and ground pins. TI recommends the value of this bypass capacitor is 0.1 μF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.

11.2 Layout Example

INA203-Q1 pcblayout.gif Figure 38. Layout Recommendation