SLYS018E April   2018  – February 2024 INA181-Q1 , INA2181-Q1 , INA4181-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 High Bandwidth and Slew Rate
      2. 7.3.2 Bidirectional Current Monitoring
      3. 7.3.3 Wide Input Common-Mode Voltage Range
      4. 7.3.4 Precise Low-Side Current Sensing
      5. 7.3.5 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3.      33
      4. 8.1.4 Summing Multiple Currents
      5. 8.1.5 Detecting Leakage Currents
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Common-Mode Transients Greater Than 26 V
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) INA181-Q1 INA2181-Q1 INA4181-Q1 UNIT
DCK (SC70) DBV (SOT-23) DSQ (WSON) DGS (VSSOP) PW (TSSOP)
6 PINS 6 PINS 10 PINS 10 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 188.0 198.7 74.5 177.3 97.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 140.8 120.9 89.7 68.7 37.7 °C/W
RθJB Junction-to-board thermal resistance 78.8 52.3 39.8 98.4 48.3 °C/W
ψJT Junction-to-top characterization parameter 62.1 30.3 3.7 12.6 3.6 °C/W
ψJB Junction-to-board characterization parameter 78.5 52.0 39.7 96.9 47.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 16.8 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.