SLYS023A December   2020  – May 2022 INA229

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (SPI)
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Versatile High Voltage Measurement Capability
      2. 7.3.2 Internal Measurement and Calculation Engine
      3. 7.3.3 Low Bias Current
      4. 7.3.4 High-Precision Delta-Sigma ADC
        1. 7.3.4.1 Low Latency Digital Filter
        2. 7.3.4.2 Flexible Conversion Times and Averaging
      5. 7.3.5 Shunt Resistor Drift Compensation
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 Multi-Alert Monitoring and Fault Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 SPI Frame
    6. 7.6 Register Maps
      1. 7.6.1 INA229 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current , Power, Energy, and Charge Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Input Filtering Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Register
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) INA229 UNIT
DGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 177.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.4 °C/W
RθJB Junction-to-board thermal resistance 99.5 °C/W
ΨJT Junction-to-top characterization parameter 9.7 °C/W
YJB Junction-to-board characterization parameter 97.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.