SBOSAC3B July   2023  – August 2025 INA745A , INA745B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Versatile Measurement Capability
      4. 6.3.4 Internal Measurement and Calculation Engine
      5. 6.3.5 High-Precision Delta-Sigma ADC
        1. 6.3.5.1 Low Latency Digital Filter
        2. 6.3.5.2 Flexible Conversion Times and Averaging
      6. 6.3.6 Integrated Precision Oscillator
      7. 6.3.7 Multi-Alert Monitoring and Fault Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Power-On Reset
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 Writing to and Reading Through the I2C Serial Interface
        2. 6.5.1.2 High-Speed I2C Mode
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 INA745x Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 ADC Output Data Rate and Noise Performance
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Configure the Device
        2. 8.2.2.2 Set Desired Fault Thresholds
        3. 8.2.2.3 Calculate Returned Values
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low loss integrated shunt resistor
    • Internal resistance: 800µΩ, TA = 25°C
    • Continuous current: ±35A, TA = 25°C
    • Peak measurement capability: ±39.32A
  • Current monitoring accuracy: A/B Grade (maximum)
    • Offset current: ±6.25mA / ±62.5mA
    • Offset drift: ±30µA/°C (A and B Grades)
    • System gain error: ±0.75% / ±1.25%
    • Common-mode rejection: ±0.125 / ±1.25mA/V
  • Power monitoring accuracy: A/B Grade, (maximum)
    • ±0.9% / ±1.6% at 25°C, full scale
  • Energy and charge accuracy: A/B Grade, (maximum)
    • ±1.4% / ±2.1% at 25°C, full scale
  • Temperature sensor: ±1.5°C (maximum at 25°C)
  • Precision oscillator: ±0.5% (maximum at 25°C)
  • Programmable conversion time and averaging
  • 2.94MHz high-speed I2C interface with 16 pin-selectable addresses
  • Operates from a 2.7V to 5.5V supply:
    • Operational current: 640µA (typical)
    • Shutdown current: 5µA (maximum)