SLLSEY7F June   2017  – April 2020 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.          Application Diagram
      2.      ISO121x Devices Reduce Board Temperatures vs Traditional Solutions
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC Specification
    10. 6.10 Switching Characteristics—AC Specification
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Test Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Sinking Inputs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 9.2.1.2.2 Thermal Considerations
          3. 9.2.1.2.3 Designing for 48-V Systems
          4. 9.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 9.2.1.2.5 Surge, ESD, and EFT Tests
          6. 9.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 9.2.1.2.7 Status LEDs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Sourcing Inputs
      3. 9.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO1211
IS Safety input, output, or supply current - side 1 RθJA = 146.1°C/W, VI = 2.75 V, TJ = 150°C,
TA = 25°C, see Figure 1
310 mA
RθJA = 146.1°C/W, VI = 3.6 V, TJ = 150°C,
TA = 25°C, see Figure 1
237
RθJA = 146.1°C/W, VI = 5.5 V, TJ = 150°C,
TA = 25°C, see Figure 1
155
IS Safety input current - field side RθJA = 146.1°C/W, VI = 24 V, TJ = 150°C,
TA = 25°C, see Figure 1
35 mA
RθJA = 146.1°C/W, VI = 36 V, TJ = 150°C,
TA = 25°C, see Figure 1
23
RθJA = 146.1°C/W, VI = 60 V, TJ = 150°C,
TA = 25°C, see Figure 1
14
PS Safety input, output, or total power RθJA = 146.1°C/W, TJ = 150°C, TA = 25°C,
see Figure 2
855 mW
TS Maximum safety temperature 150 °C
ISO1212
IS Safety input, output, or supply current - side 1 RθJA = 116.9°C/W, VI = 2.75 V, TJ = 150°C,
TA = 25°C, see Figure 3
389 mA
RθJA= 116.9°C/W, VI = 3.6 V, TJ = 150°C,
TA = 25°C, see Figure 3
297
RθJA = 116.9°C/W, VI = 5.5 V, TJ = 150°C,
TA = 25°C, see Figure 3
194
IS Safety input current - field side RθJA = 116.9°C/W, VI = 24 V, TJ = 150°C,
TA = 25°C, see Figure 3
44 mA
RθJA= 116.9°C/W, VI = 36 V, TJ = 150°C,
TA = 25°C, see Figure 3
29
RθJA = 116.9°C/W, VI = 60 V, TJ = 150°C,
TA = 25°C, see Figure 3
17
PS Safety input, output, or total power RθJA = 116.9°C/W, TJ = 150°C, TA = 25°C,
see Figure 4
1070 mW
TS Maximum safety temperature 150 °C
The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.