SLOS581J may   2008  – august 2023 ISO3080 , ISO3082 , ISO3086 , ISO3088

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Insulation Specifications
    6. 6.6  Safety-Related Certifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics: Driver
    9. 6.9  Electrical Characteristics: Receiver
    10. 6.10 Supply Current
    11. 6.11 Switching Characteristics: Driver
    12. 6.12 Switching Characteristics: Receiver
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.11 Switching Characteristics: Driver

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ALL DEVICES
tPHL, tPLH Propagation delay ISO3080/82, See Figure 14 0.7 1.3 µs
ISO3086/88, See Figure 14 25 45 ns
PWD Pulse width distortion(1), |tPHL – tPLH| ISO3080/82, See Figure 14 20 200 ns
ISO3086/88, See Figure 14 3 9 ns
tr, tf Differential output rise time and fall time ISO3080/82, See Figure 14 0.5 0.9 1.5 µs
ISO3086/88, See Figure 14 7 15 ns
tPZH, tPZL
Propagation delay,
high-impedance-tohigh-level output and
high-impedance-tolow-level output


 ISO3080/82, See Figure 15 and Figure 16, DE at 0 V, 50% Vo 2.5 7 µs
ISO3080/82, See Figure 15 and Figure 16, DE at 0 V, 90% Vo 1.8 µs
ISO3086/88, See Figure 15 and 16 25 55 ns
tPHZ, tPLZ
Propagation delay,
high-level-to-highimpedance output
and low-level to highimpedance output


 ISO3080/28, See Figure 15 and 16 95 225 ns
ISO3086/88, See Figure 15 and 16 25 55 ns
(1) Also known as pulse skew.